74ACT16244
- Members of the Texas Instruments WidebusTM Family
- Inputs Are TTL-Voltage Compatible
- 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
- Flow-Through Architecture Optimizes PCB Layout
- Distributed VCC and GND Pin Configurations Minimize High-Speed Switching Noise
- EPICTM (Enhanced-Performance Implanted CMOS) 1-
m Process - 500-mA Typical Latch-Up Immunity at 125°C
- Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
The SN54ACT16244 and 74ACT16244 are 16-bit buffers/line drivers
designed specifically to improve both the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented
receivers and transmitters. They can be used as four 4-bit buffers,
two 8-bit buffers, or one 16-bit buffer. The devices provide true
outputs and symmetrical 
(active-low) output-enable inputs.
The 74ACT16244 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.
The SN54ACT16244 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT16244 is characterized for operation from -40°C to 85°C.
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技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | SN54ACT16244, 74ACT16244 datasheet (Rev. B) | 1996年 4月 1日 | |
| Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021年 7月 26日 | ||
| Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004年 6月 22日 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
| Application note | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997年 6月 1日 | ||
| Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
| Application note | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996年 4月 1日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 引腳 | 下載 |
|---|---|---|
| SSOP (DL) | 48 | 檢視選項 |
| TSSOP (DGG) | 48 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點