產品詳細資料

Number of channels 6 Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 8 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Supply current (max) (µA) 600 Features Balanced outputs, Positive input clamp diode, Standard speed (tpd > 50ns) Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 6 Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 8 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Supply current (max) (µA) 600 Features Balanced outputs, Positive input clamp diode, Standard speed (tpd > 50ns) Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 16 135.3552 mm² 19.56 x 6.92
  • 5-V, 10-V, and 15-V parametric ratings
  • Standardized, symmetrical output characteristics
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range) =
            1 V at VDD = 5 V
            2 V at VDD = 10 V
         2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Applications:
    • Shift Registers
    • Buffer/Storage Registers
    • Pattern Generators

  • 5-V, 10-V, and 15-V parametric ratings
  • Standardized, symmetrical output characteristics
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range) =
            1 V at VDD = 5 V
            2 V at VDD = 10 V
         2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Applications:
    • Shift Registers
    • Buffer/Storage Registers
    • Pattern Generators

Cd40174B consists of six identical ’D’-type flip-flops having independent DATA inputs. The CLOCK and CLEAR\ inputs are common to all six units. Data are transferred to the Q outputs on the positive-going transition of the clock pulse. All sic flip-flops are simultaneously reset by a low level on the CLEAR\ input.

The CD40174B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

Cd40174B consists of six identical ’D’-type flip-flops having independent DATA inputs. The CLOCK and CLEAR\ inputs are common to all six units. Data are transferred to the Q outputs on the positive-going transition of the clock pulse. All sic flip-flops are simultaneously reset by a low level on the CLEAR\ input.

The CD40174B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 8
類型 標題 日期
* Data sheet CD40174B TYPES datasheet (Rev. C) 2003年 10月 13日
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
User guide Signal Switch Data Book (Rev. A) 2003年 11月 14日
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 2001年 12月 3日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

封裝 引腳 下載
CDIP (J) 16 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片