DRV8808
- Three DC Motor Drivers
- Up to 2.5-A Current Chopping
- Low Typical ON Resistance (RDSON = 0.5 Ω at TJ = 25°C)
- Three Integrated DC-DC Converters
- ON/OFF Selectable Using CSELECT Pin and Serial Interface
- Outputs Configurable With External Resistor Network From 1 V to 90% of VM Capability for All Three Channels
- 1.35-A Output Capability for All Three Channels
- One Integrated LDO Regulator
- Output Configurable With External Resistor Network from 1 V to 2.5 V
- 550-mA Output Capability
- 7-V to 40-V Operating Range
- Serial Interface for Communications
- Thermally Enhanced Surface-Mount Package
48-Pin HTSSOP With PowerPAD
(Eco-Friendly: RoHS and No Sb/Br ) - Power-Down Function (Deep-Sleep Mode)
- Reset Signal Output (Active Low)
- Reset (All Clear) Control Input
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners
The DRV8808 device provides the integrated motor driver solution for printers. The chip has three full H-bridges and three buck DC-DC converters.
The output driver block for each consists of N-channel power MOSFETs configured as full H-bridges to drive the motor windings. The device can be configured to use internal or external current sense for winding current control.
The SPI input pins are 3.3-V compatible and have inputs that are 5-V tolerant.
The DRV8808 has three DC-DC switched-mode buck converters to generate a programmable output voltage from 1 V up to 90% of VM, with up to 1.35-A load current capability.
The device is configured using the CSELECT terminal at start-up, and serial interface during run time.
An internal shutdown function is provided for overcurrent protection, short-circuit protection, undervoltage lockout, and thermal shutdown. Also, the device has the reset function at power on, and the input on the nReset pin.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DRV8808 Combination Motor Driver With DC-DC Converter datasheet (Rev. B) | PDF | HTML | 2015年 1月 31日 |
| Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018年 7月 6日 | ||
| Application brief | PowerPAD™ Made Easy (Rev. B) | 2004年 5月 12日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 引腳 | 下載 |
|---|---|---|
| HTSSOP (DCA) | 48 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點