DS92LV010A
- Bus LVDS Signaling (BLVDS)
- Designed for Double Termination Applications
- Balanced Output Impedance
- Lite Bus Loading 5pF Typical
- Glitch Free Power Up/Down (Driver Disabled)
- 3.3V or 5.0V Operation
- ±1V Common Mode Range
- ±100mV Receiver Sensitivity
- High Signaling Rate Capability (Above 100 Mbps)
- Low Power CMOS Design
- Product Offered in 8 Lead SOIC Package
- Industrial Temperature Range Operation
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The DS92LV010A is one in a series of transceivers designed specifically for the high speed, low power proprietary bus backplane interfaces. The device operates from a single 3.3V or 5.0V power supply and includes one differential line driver and one receiver. To minimize bus loading the driver outputs and receiver inputs are internally connected. The logic interface provides maximum flexibility as 4 separate lines are provided (DIN, DE, RE, and ROUT). The device also features flow through which allows easy PCB routing for short stubs between the bus pins and the connector. The driver has 10 mA drive capability, allowing it to drive heavily loaded backplanes, with impedance as low as 27 Ohms.
The driver translates between TTL levels (single-ended) to Low Voltage Differential Signaling levels. This allows for high speed operation, while consuming minimal power with reduced EMI. In addition the differential signaling provides common mode noise rejection of ±1V.
The receiver threshold is ±100mV over a ±1V common mode range and translates the low voltage differential levels to standard (CMOS/TTL) levels.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DS92LV010A Bus LVDS 3.3/5.0V Single Transceiver datasheet (Rev. E) | 2013年 4月 16日 | |
| Application note | LVDS Signal Quality: Cable Drive Measurements using Eye Patterns Test Report #3 | 2004年 5月 15日 | ||
| Application note | DS92LV010A Bus LVDS Transcvr Ushers New Era of High-Perf Backplane Design | 2004年 5月 15日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 引腳 | 下載 |
|---|---|---|
| SOIC (D) | 8 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。