ESDS302
- IEC 61000-4-2 level 4 ESD protection:
- ±30kV contact discharge
- ±30kV air gap discharge
- IEC 61000-4-4 EFT protection:
- 80 A (5/50ns)
- IEC 61000-4-5 surge protection:
- 12A (8/20µs)
- Low surge clamping voltage 6V at 12A Ipp
- IO capacitance:
- 2.3pF (typical)
- DC breakdown voltage: 4.5V (minimum)
- Ultra low leakage current: 3nA (typical)
- Supports high speed interfaces up to 1 Gbps
- Industrial temperature range: –40°C to +125°C
- Easy flow-through routing package (ESDS302)
The ESDS302, ESDS304 devices are uni-directional TVS ESD protection diode array in two and four channel configurations respectively, for Ethernet and USB surge protection up to 12A (8/20µs). The ESDS302, ESDS304 devices are rated to dissipate ESD strikes up to 30kV per the IEC 61000-4-2 international standard (> Level 4).
The devices features a 2.3pF IO capacitance per channel making it an excellent choice for protecting high-speed interfaces such as Ethernet™ 1G and USB 2.0. The low dynamic resistance and low clamping voltage provides system level protection against transient events.
The ESDS302, ESDS304 devices are offered in the industry standard 5-pin SOT23 packages.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | ESDS30x Data-Line Surge and ESD Protection Devices for High Speed Interfaces datasheet (Rev. B) | PDF | HTML | 2024年 1月 31日 |
| Application note | ESD and Surge Protection for USB Interfaces (Rev. B) | PDF | HTML | 2024年 1月 11日 | |
| Selection guide | System-Level ESD Protection Guide (Rev. D) | 2022年 9月 7日 | ||
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 | |
| Application note | IEEE 802.3cg 10BASE-T1L Power over Data Lines Powered Device Design (Rev. A) | PDF | HTML | 2022年 6月 2日 | |
| Application note | Protecting Ethernet Ports from Surge Events (Rev. A) | PDF | HTML | 2022年 4月 27日 | |
| White paper | Demystifying surge protection | 2018年 11月 6日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
ESDEVM — 通用 ESD 評估模組
<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
(...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 引腳 | 下載 |
|---|---|---|
| SOT-23 (DBV) | 5 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。