現在提供此產品的更新版本
功能相同,但引腳輸出與所比較的裝置不同
HDC1010
- Relative Humidity Accuracy ±2% (typical)
- Temperature Accuracy ±0.2°C (typical)
- Excellent Stability at High Humidity
- 14 Bit Measurement Resolution
- 100 nA Sleep Mode Current
- Average Supply Current:
- 710 nA @ 1 sps, 11 bit RH Measurement
- 1.3 µA @ 1 sps, 11 bit RH and Temperature Measurement
- Supply Voltage 2.7 V to 5.5 V
- Tiny 2 mm × 1.6 mm Device Footprint
- I2C Interface
The HDC1010 is a digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The HDC1010 operates over a wide supply range, and is a low cost, low power alternative to competitive solutions in a wide range of common applications. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1010 is placed on the bottom part of the device, which makes the HDC1010 more robust against dirt, dust, and other environmental contaminants. The humidity and temperature sensors are factory calibrated and the calibration data is stored in the on-chip non-volatile memory.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | HDC1010 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor datasheet (Rev. A) | PDF | HTML | 2016年 8月 29日 |
Application note | Is a Protective Cover Needed for Humidity Sensors? | PDF | HTML | 2021年 4月 21日 | |
Application note | Humidity Sensor: Storage and Handling Guidelines | 2017年 8月 28日 | ||
Application note | Optimizing Placement and Routing for Humidity Sensors (Rev. A) | 2017年 3月 6日 | ||
Application note | HDC1010 Pin FMEA | 2016年 12月 15日 | ||
EVM User's guide | HDC1010EVM User’s Guide | 2016年 5月 11日 | ||
Technical article | How to use boost converters in wireless sensor nodes | PDF | HTML | 2015年 10月 6日 |
設計與開發
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HDC1010EVM — HDC1010 低功耗濕度和溫度感測器評估模組
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YPA) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點