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HVDA553-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to +125°C
Ambient Operating Temperature - Device HBM ESD Classification Level:
- Level 3B for Pins 6 and 7
- Level 3A for All Other Pins
- Device CDM ESD Classification Level C6
- Device Temperature Grade 1: –40°C to +125°C
- Meets or Exceeds the Requirements of ISO 11898-2 and ISO 11898-5
- GIFT/ICT Compliant
- Data Rate Up to 1 Mbps
- ESD Protection Up to ±12 kV (Human-Body Model) on Bus Pins
- I/O Voltage Level Adapting
- HVDA551: Adaptable I/O Voltage Range (VIO) From 3 V to 5.33 V
- SPLIT Voltage Source
- HVDA553: Common-Mode Bus Stabilization
- Operating Modes:
- Normal Mode
- Low-Power Standby Mode With RXD Wake-Up Request
- High Electromagnetic Compliance (EMC)
- Supports CAN Flexible Data-Rate (FD)
- Protection
- Undervoltage Protection on VIO and VCC
- Bus-Fault Protection of –27 V to 40 V
- TXD Dominant State Time-Out
- RXD Wake-Up Request Lockout on CAN Bus Stuck Dominant Fault (HVDA551)
- Digital Inputs Compatible With 5-V Microprocessors (HVDA553)
- Thermal Shutdown Protection
- Power-Up and Power-Down Glitch-Free Bus I/O
- High Bus Input Impedance When Unpowered (No Bus Load)
The HVDA55x-Q1 device is designed and qualified for use in automotive applications and meets or exceeds the specifications of the ISO 11898 High Speed CAN (Controller Area Network) Physical Layer standard (transceiver).
技術文件
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檢視所有 1 類型 | 標題 | 日期 | ||
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* | Data sheet | HVDA55x-Q1 5-V CAN Transceiver With I/O Level Adapting and Low-Power-Mode Supply Optimization datasheet (Rev. B) | PDF | HTML | 2016年 2月 3日 |
設計與開發
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模擬工具
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模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
參考設計
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訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點
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