LM4808
- WSON, VSSOP, and SOIC Surface Mount Packaging
- Switch On/Off Click Suppression
- Excellent Power Supply Ripple Rejection
- Unity-Gain Stable
- Minimum External Components
Key Specifications
- THD+N at 1kHz at 105mW Continuous Average Output Power Into 16Ω 0.1 % (typ)
- THD+N at 1kHz at 70mW Continuous Average Output Power Into 32Ω 0.1 % (typ)
- Output Power at 0.1% THD+N at 1kHz Into 32Ω 70 mW (typ)
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The LM4808 is a dual audio power amplifier capable of delivering 105mW per channel of continuous average power into a 16Ω load with 0.1% (THD+N) from a 5V power supply.
Boomer audio power amplifiers were designed specifically to provide high quality output power with a minimal amount of external components using surface mount packaging. Since the LM4808 does not require bootstrap capacitors or snubber networks, it is optimally suited for low-power portable systems.
The unity-gain stable LM4808 can be configured by external gain-setting resistors.
技術文件
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檢視所有 3 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | LM4808 Dual 105 mW Headphone Amplifier datasheet (Rev. D) | 2013年 5月 1日 | |
| Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||
| Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 |
設計與開發
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模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
參考設計
TIDEP0017 — PRU 即時 I/O 評估參考設計
This reference design is a BeagleBone Black add-on board that allows users get to know TI’s powerful Programmable Real-Time Unit (PRU) core and basic functionality. The PRU is a low-latency microcontroller subsystem integrated in the Sitara AM335x and AM437x family of devices. The (...)
| 封裝 | 引腳 | 下載 |
|---|---|---|
| SOIC (D) | 8 | 檢視選項 |
| VSSOP (DGK) | 8 | 檢視選項 |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。