產品詳細資料

Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 160 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, High speed (tpd 10-50ns), Input clamp diode Rating Military Operating temperature range (°C) -55 to 125
Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 160 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, High speed (tpd 10-50ns), Input clamp diode Rating Military Operating temperature range (°C) -55 to 125
CFP (WD) 48 153.4008 mm² 15.88 x 9.66
  • Members of the Texas Instruments WidebusTM Family
  • Inputs Are TTL-Voltage Compatible
  • 3-State Outputs Drive Bus Lines Directly
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Configuration to Minimize High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings, Thin Shrink Small-Outline (DGG) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

  • Members of the Texas Instruments WidebusTM Family
  • Inputs Are TTL-Voltage Compatible
  • 3-State Outputs Drive Bus Lines Directly
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Configuration to Minimize High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings, Thin Shrink Small-Outline (DGG) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The SN54ACT16245 and 74ACT16245 are 16-bit bus transceivers organized as dual-octal noninverting 3-state transceivers and designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements.

The devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The enable (G\) input can be used to disable the devices so that the buses are effectively isolated.

The SN54ACT16245 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT16245 is characterized for operation from -40°C to 85°C.

 

 

The SN54ACT16245 and 74ACT16245 are 16-bit bus transceivers organized as dual-octal noninverting 3-state transceivers and designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements.

The devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The enable (G\) input can be used to disable the devices so that the buses are effectively isolated.

The SN54ACT16245 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT16245 is characterized for operation from -40°C to 85°C.

 

 

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類型 標題 日期
* Data sheet 16-Bit Bus Transceivers With 3-State Outputs datasheet (Rev. B) 1996年 4月 1日
* SMD SN54ACT16245 SMD 5962-92023 2016年 6月 21日
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note Selecting the Right Level Translation Solution (Rev. A) 2004年 6月 22日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
Application note Designing With Logic (Rev. C) 1997年 6月 1日
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996年 4月 1日

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