SN65HVDA100-Q1

現行

LIN 實體介面

現在提供此產品的更新版本

open-in-new 比較替代產品
具備升級功能,可直接投入使用替代所比較的產品
TLIN1021A-Q1 現行 具抑制和喚醒功能的車用故障防護 LIN 收發器 Newer version

產品詳細資料

Protocols LIN Number of channels 1 Supply voltage (V) 5 to 27 Bus fault voltage (V) -27 to 45 Signaling rate (max) (Bits) 100000 Rating Automotive
Protocols LIN Number of channels 1 Supply voltage (V) 5 to 27 Bus fault voltage (V) -27 to 45 Signaling rate (max) (Bits) 100000 Rating Automotive
SOIC (D) 8 29.4 mm² 4.9 x 6
  • AEC-Q100 (Grade 1) qualified for automotive applications
  • Compliant with LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, and ISO/DIS 17987-4 electrical physical layer (EPL) specification
  • Extended operation with supply from 5 V to 27 V DC
  • LIN Transmits speed up to 20-kbps (LIN specified maximum), high-speed receive capable
  • Sleep mode: ultra-low current consumption allows wake-up events from:
    • LIN bus
    • wake-up through EN
  • Wake-up request on RXD pin
  • Wake-up source recognition on TXD pin
  • Interfaces to MCU with 5-V or 3.3-V I/O pins
  • High electromagnetic compatibility (EMC)
  • Control of external voltage regulator (INH Pin)
  • Supports ISO9141 (K-line)
  • ESD protection to ±12 kV (human body model) on LIN pin
  • LIN pin handles voltage from –27 V to 45 V (short to battery or ground)
  • Survives transient damage in automotive environment (ISO 7637)
  • Undervoltage protection on VSUP
  • TXD dominant state time-out protection
  • Prevention of false wakeups with false wake-up lockout
  • Thermal shutdown
  • Unpowered node or ground disconnection failsafe at system level, node does not disturb bus (no load on bus)
  • AEC-Q100 (Grade 1) qualified for automotive applications
  • Compliant with LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, and ISO/DIS 17987-4 electrical physical layer (EPL) specification
  • Extended operation with supply from 5 V to 27 V DC
  • LIN Transmits speed up to 20-kbps (LIN specified maximum), high-speed receive capable
  • Sleep mode: ultra-low current consumption allows wake-up events from:
    • LIN bus
    • wake-up through EN
  • Wake-up request on RXD pin
  • Wake-up source recognition on TXD pin
  • Interfaces to MCU with 5-V or 3.3-V I/O pins
  • High electromagnetic compatibility (EMC)
  • Control of external voltage regulator (INH Pin)
  • Supports ISO9141 (K-line)
  • ESD protection to ±12 kV (human body model) on LIN pin
  • LIN pin handles voltage from –27 V to 45 V (short to battery or ground)
  • Survives transient damage in automotive environment (ISO 7637)
  • Undervoltage protection on VSUP
  • TXD dominant state time-out protection
  • Prevention of false wakeups with false wake-up lockout
  • Thermal shutdown
  • Unpowered node or ground disconnection failsafe at system level, node does not disturb bus (no load on bus)

The SN65HVDA100-Q1 device is a Local Interconnect Network (LIN) physical interface, which integrates the serial transceiver with wakeup and protection features. The LIN bus is a single-wire bidirectional bus typically used for low-speed in-vehicle networks using data rates from 2.4 kbps to 20 kbps. The LIN protocol output data stream on TXD is converted by the SN65HVDA100-Q1 into the LIN bus signal through a current-limited wave-shaping driver as outlined by the LIN Physical Layer Specification and ISO 17987. The receiver converts the data stream from the LIN bus and outputs the data stream through RXD. The LIN bus has two states: dominant state (voltage near ground) and recessive state (voltage near battery). In the recessive state, the LIN bus is pulled high by the internal pullup resistor (30 kΩ) and series diode, so no external pullup components are required for responder applications. Commander applications require an external pullup resistor (1 kΩ) plus a series diode per the LIN specification.

The SN65HVDA100-Q1 device is a Local Interconnect Network (LIN) physical interface, which integrates the serial transceiver with wakeup and protection features. The LIN bus is a single-wire bidirectional bus typically used for low-speed in-vehicle networks using data rates from 2.4 kbps to 20 kbps. The LIN protocol output data stream on TXD is converted by the SN65HVDA100-Q1 into the LIN bus signal through a current-limited wave-shaping driver as outlined by the LIN Physical Layer Specification and ISO 17987. The receiver converts the data stream from the LIN bus and outputs the data stream through RXD. The LIN bus has two states: dominant state (voltage near ground) and recessive state (voltage near battery). In the recessive state, the LIN bus is pulled high by the internal pullup resistor (30 kΩ) and series diode, so no external pullup components are required for responder applications. Commander applications require an external pullup resistor (1 kΩ) plus a series diode per the LIN specification.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 2
類型 標題 日期
* Data sheet SN65HVDA100-Q1 LIN Physical Interface datasheet (Rev. D) PDF | HTML 2022年 4月 19日
Application note LIN Protocol and Physical Layer Requirements (Rev. A) PDF | HTML 2022年 8月 24日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
參考設計

TIDA-00271 — 適用遠端攝影機和雷達模組的 ADAS 感測器互連參考設計基板

The ADAS Sensor Interconnect Board is intended for applications where remote sensors like cameras, LIDAR or radar modules need to be connected to a central processing ECU. The board supports up to 3 coaxial and 1 LVDS twisted pair data inputs as well as 3 FMC cable and 1 board to board connector as (...)
Test report: PDF
電路圖: PDF
封裝 引腳 下載
SOIC (D) 8 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片