產品詳細資料

Number of channels 2 Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 90 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 20 Features Balanced outputs, Positive input clamp diode, Very high speed (tpd 5-10ns) Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product
Number of channels 2 Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 90 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 20 Features Balanced outputs, Positive input clamp diode, Very high speed (tpd 5-10ns) Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product
SOIC (D) 14 51.9 mm² 8.65 x 6
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • 4.5-V to 5.5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 10.5 ns at 5 V
  • Inputs Are TTL-Voltage Compatible

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • 4.5-V to 5.5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 10.5 ns at 5 V
  • Inputs Are TTL-Voltage Compatible

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The SN74ACT74-EP is a dual positive-edge-triggered D-type flip-flop.

A low level at the preset (PRE\) or clear (CLR\) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE\ and CLR\ are inactive (high), data at the data (D) input meeting the setup-time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at D can be changed without affecting the levels at the outputs.

The SN74ACT74-EP is a dual positive-edge-triggered D-type flip-flop.

A low level at the preset (PRE\) or clear (CLR\) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE\ and CLR\ are inactive (high), data at the data (D) input meeting the setup-time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at D can be changed without affecting the levels at the outputs.

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類型 標題 日期
* Data sheet SN74ACT74-EP datasheet 2003年 9月 30日
* VID SN74ACT74-EP VID V6204725 2016年 6月 21日
* Radiation & reliability report SN74ACT74MDREP Reliability Report 2012年 6月 4日
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note Selecting the Right Level Translation Solution (Rev. A) 2004年 6月 22日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
Application note Designing With Logic (Rev. C) 1997年 6月 1日
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996年 4月 1日

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