SN74CB3Q3257
- High-Bandwidth Data Path
(up to 500 MHz) - 5-V Tolerant I/Os With Device Powered Up or Powered Down
- Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range
(ron= 4 Ω Typical) - Rail-to-Rail Switching on Data I/O Ports
- 0- to 5-V Switching With 3.3-V VCC
- 0- to 3.3-V Switching With 2.5-V VCC
- Bidirectional Data Flow With Near-Zero Propagation Delay
- Low Input and Output Capacitance Minimizes Loading and Signal Distortion
(Cio(OFF) = 3.5 pF Typical) - Fast Switching Frequency (f OE = 20 MHz Maximum)
- Data and Control Inputs Provide Undershoot Clamp Diodes
- Low Power Consumption
(ICC = 0.7 mA Typical) - VCC Operating Range From 2.3 V to 3.6 V
- Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) - Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs - Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human Body Model
- Supports Both Digital and Analog Applications: USB Interface, Differential Signal Interface,
Bus Isolation, Low-Distortion Signal Gating (1)
(1)For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, SCDA008.
The SN74CB3Q3257 device is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron).
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檢視所有 11 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | SN74CB3Q3257 4-Bit 1-of-2 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch datasheet (Rev. D) | PDF | HTML | 2018年 7月 9日 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
| Application note | CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C) | PDF | HTML | 2021年 11月 19日 | |
| Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
| More literature | Digital Bus Switch Selection Guide (Rev. A) | 2004年 11月 10日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
| User guide | Signal Switch Data Book (Rev. A) | 2003年 11月 14日 | ||
| Application note | Bus FET Switch Solutions for Live Insertion Applications | 2003年 2月 7日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
開發板
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使用指南: PDF
開發板
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The TAS2770EVM-Stereo evaluation module provides developers with a simple to use module pre-configured in as a stereo solution. It is powerful tool kit for assessing stereo or mono implementations of the TAS2770 with or without IV sense. Everything needed for evaluating TAS2770 as a conventional (...)
使用指南: PDF
介面轉接器
LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
使用指南: PDF
介面轉接器
LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
使用指南: PDF
參考設計
TIDA-01572 — 數位輸入、D 類、IV 感測音訊放大器的立體聲評估模組參考設計
This reference design provides a high-performance stereo audio subsystem for use in PC applications. It operates off a single supply, ranging from 4.5 V to 16 V, and features the TAS2770, a digital-input Class-D audio amplifier that provides excellent noise and distortion performance and is (...)
| 封裝 | 引腳 | 下載 |
|---|---|---|
| SSOP (DBQ) | 16 | 檢視選項 |
| TSSOP (PW) | 16 | 檢視選項 |
| TVSOP (DGV) | 16 | 檢視選項 |
| VQFN (RGY) | 16 | 檢視選項 |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。