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SN74CB3T3245

現行

具有電平移位器的 3.3-V、1:1 (SPST)、8 通道 FET 匯流排開關

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產品規格表

SN74CB3T3245

現行
產品規格表 立即訂購

產品詳細資料

Configuration 1:1 SPST Number of channels 8 Power supply voltage - single (V) 2.5, 3.3 Protocols Analog Ron (typ) (Ω) 5 CON (typ) (pF) 5 ON-state leakage current (max) (µA) 20 Bandwidth (MHz) 100 Operating temperature range (°C) -40 to 85 Features Powered-off protection, Signal path translation Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 3.6 Supply voltage (max) (V) 3.6
Configuration 1:1 SPST Number of channels 8 Power supply voltage - single (V) 2.5, 3.3 Protocols Analog Ron (typ) (Ω) 5 CON (typ) (pF) 5 ON-state leakage current (max) (µA) 20 Bandwidth (MHz) 100 Operating temperature range (°C) -40 to 85 Features Powered-off protection, Signal path translation Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 3.6 Supply voltage (max) (V) 3.6
SOIC (DW) 20 131.84 mm² 12.8 x 10.3 SSOP (DBQ) 20 51.9 mm² 8.65 x 6 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4 TVSOP (DGV) 20 32 mm² 5 x 6.4
  • Standard ’245-Type Pinout
  • Output Voltage Translation Tracks VCC
  • Supports Mixed-Mode Signal Operation on All Data I/O Ports
    • 5-V Input Down to 3.3-V Output Level Shift With 3.3-V VCC
    • 5-V/3.3-V Input Down to 2.5-V Output Level Shift With 2.5-V VCC
  • 5-V-Tolerant I/Os With Device Powered Up or Powered Down
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron) Characteristics (ron = 5 Ω Typical)
  • Low Input/Output Capacitance Minimizes Loading (Cio(OFF) = 5 pF Typical)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption (ICC = 40 µA Maximum)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0- to 5-V Signaling Levels
    (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
  • Control Inputs Can Be Driven by TTL or
    5-V/3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Ideal for Low-Power Portable Equipment
  • Standard ’245-Type Pinout
  • Output Voltage Translation Tracks VCC
  • Supports Mixed-Mode Signal Operation on All Data I/O Ports
    • 5-V Input Down to 3.3-V Output Level Shift With 3.3-V VCC
    • 5-V/3.3-V Input Down to 2.5-V Output Level Shift With 2.5-V VCC
  • 5-V-Tolerant I/Os With Device Powered Up or Powered Down
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron) Characteristics (ron = 5 Ω Typical)
  • Low Input/Output Capacitance Minimizes Loading (Cio(OFF) = 5 pF Typical)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption (ICC = 40 µA Maximum)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0- to 5-V Signaling Levels
    (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
  • Control Inputs Can Be Driven by TTL or
    5-V/3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Ideal for Low-Power Portable Equipment

The SN74CB3T3245 device is a high-speed TTL-compatible 8-bit FET bus switch with low ON-state resistance (ron), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks VCC.

The SN74CB3T3245 device is a high-speed TTL-compatible 8-bit FET bus switch with low ON-state resistance (ron), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks VCC.
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類型 標題 日期
* Data sheet SN74CB3T3245 8-Bit FET Bus Switch 2.5-V and 3.3-V Low-Voltage With 5-V-Tolerant Level Shifter datasheet (Rev. C) PDF | HTML 2018年 5月 31日
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022年 6月 2日
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021年 12月 1日
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C) PDF | HTML 2021年 11月 19日
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML 2021年 1月 6日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note How to Select Little Logic (Rev. A) 2016年 7月 26日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
More literature Digital Bus Switch Selection Guide (Rev. A) 2004年 11月 10日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note Selecting the Right Level Translation Solution (Rev. A) 2004年 6月 22日
User guide Signal Switch Data Book (Rev. A) 2003年 11月 14日
Application note Bus FET Switch Solutions for Live Insertion Applications 2003年 2月 7日

設計與開發

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介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

使用指南: PDF
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模擬型號

HSPICE Model for SN74CB3T3245

SCDJ028.ZIP (99 KB) - HSpice Model
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模擬型號

SN74CB3T3245 IBIS Model

SCDM055.ZIP (26 KB) - IBIS Model
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封裝 引腳 下載
SOIC (DW) 20 檢視選項
SSOP (DBQ) 20 檢視選項
TSSOP (PW) 20 檢視選項
TVSOP (DGV) 20 檢視選項
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