產品詳細資料

Number of channels 8 Technology family LS Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Input type Bipolar Output type 3-State Clock frequency (max) (MHz) 35 IOL (max) (mA) 24 IOH (max) (mA) -2.6 Supply current (max) (µA) 40000 Features High speed (tpd 10-50ns) Operating temperature range (°C) 0 to 70 Rating Catalog
Number of channels 8 Technology family LS Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Input type Bipolar Output type 3-State Clock frequency (max) (MHz) 35 IOL (max) (mA) 24 IOH (max) (mA) -2.6 Supply current (max) (µA) 40000 Features High speed (tpd 10-50ns) Operating temperature range (°C) 0 to 70 Rating Catalog
PDIP (N) 20 228.702 mm² 24.33 x 9.4 SOIC (DW) 20 131.84 mm² 12.8 x 10.3 SOP (NS) 20 98.28 mm² 12.6 x 7.8
  • Choice of Eight Latches or Eight D-Type Flip-Flops in a Single Package
  • 3-State Bus-Driving Outputs
  • Full Parallel Access for Loading
  • Buffered Control Inputs
  • Clock-Enable Input Has Hysteresis to Improve Noise Rejection (’S373 and ’S374)
  • P-N-P Inputs Reduce DC Loading on Data Lines (’S373 and ’S374)

  • Choice of Eight Latches or Eight D-Type Flip-Flops in a Single Package
  • 3-State Bus-Driving Outputs
  • Full Parallel Access for Loading
  • Buffered Control Inputs
  • Clock-Enable Input Has Hysteresis to Improve Noise Rejection (’S373 and ’S374)
  • P-N-P Inputs Reduce DC Loading on Data Lines (’S373 and ’S374)

These 8-bit registers feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The high-impedance 3-state and increased high-logic-level drive provide these registers with the capability of being connected directly to and driving the bus lines in a bus-organized system without need for interface or pullup components. These devices are particularly attractive for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The eight latches of the ’LS373 and ’S373 are transparent D-type latches, meaning that while the enable (C or CLK) input is high, the Q outputs follow the data (D) inputs. When C or CLK is taken low, the output is latched at the level of the data that was set up.

The eight flip-flops of the ’LS374 and ’S374 are edge-triggered D-type flip-flops. On the positive transition of the clock, the Q outputs are set to the logic states that were set up at the D inputs.

Schmitt-trigger buffered inputs at the enable/clock lines of the ’S373 and ’S374 devices simplify system design as ac and dc noise rejection is improved by typically 400 mV due to the input hysteresis. A buffered output-control (OC) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.

OC\ does not affect the internal operation of the latches or flip-flops. That is, the old data can be retained or new data can be entered, even while the outputs are off.

These 8-bit registers feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The high-impedance 3-state and increased high-logic-level drive provide these registers with the capability of being connected directly to and driving the bus lines in a bus-organized system without need for interface or pullup components. These devices are particularly attractive for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The eight latches of the ’LS373 and ’S373 are transparent D-type latches, meaning that while the enable (C or CLK) input is high, the Q outputs follow the data (D) inputs. When C or CLK is taken low, the output is latched at the level of the data that was set up.

The eight flip-flops of the ’LS374 and ’S374 are edge-triggered D-type flip-flops. On the positive transition of the clock, the Q outputs are set to the logic states that were set up at the D inputs.

Schmitt-trigger buffered inputs at the enable/clock lines of the ’S373 and ’S374 devices simplify system design as ac and dc noise rejection is improved by typically 400 mV due to the input hysteresis. A buffered output-control (OC) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.

OC\ does not affect the internal operation of the latches or flip-flops. That is, the old data can be retained or new data can be entered, even while the outputs are off.

下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
引腳對引腳的功能與所比較的產品相同
CD74ACT373 現行 具有 3 態輸出的八路透明鎖存 Shorter average propagation delay (8ns), higher average drive strength (24mA)

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 11
類型 標題 日期
* Data sheet Octal D-Type Transparent Latches And Edge-Triggered Flip-Flops datasheet (Rev. B) 2002年 8月 23日
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note Designing With Logic (Rev. C) 1997年 6月 1日
Application note Designing with the SN54/74LS123 (Rev. A) 1997年 3月 1日
Application note Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
Application note Live Insertion 1996年 10月 1日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組

14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。

使用指南: PDF | HTML
TI.com 無法提供
模擬型號

SN74LS373 IBIS Model

SDLM018.ZIP (11 KB) - IBIS Model
封裝 引腳 下載
PDIP (N) 20 檢視選項
SOIC (DW) 20 檢視選項
SOP (NS) 20 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片