SN74LVC573A
- Operate From 1.65 V to 3.6 V
- Inputs Accept Voltages to 5.5 V
- Max tpd of 6.9 ns at 3.3 V
- Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
> 2 V at VCC = 3.3 V, TA = 25°C - Support Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC)
- Ioff Supports Live Insertion, Partial Power Down Mode, and Back Drive Protection
- Latch-Up Performance Exceeds 250 mA
Per JESD 17 - ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
The SN54LVC573A octal transparent D-type latch is designed for 2.7-V to 3.6-V VCC operation, and the SN74LVC573A octal transparent D-type latch is designed for 1.65-V to 3.6-V VCC operation. These devices feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, input/output (I/O) ports, bidirectional bus drivers, and working registers.
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開發板
14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組
14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
開發板
14-24-NL-LOGIC-EVM — 適用於 14 針腳至 24 針腳無引線封裝的邏輯產品通用評估模組
14-24-NL-LOGIC-EVM 是一款靈活的評估模組 (EVM),設計用途可支援任何具有 14 針腳至 24 針腳 BQA、BQB、RGY、RSV、RJW 或 RHL 封裝的邏輯或轉換裝置。
參考設計
TIDA-010132 — 適合於雷達和電子戰應用的多通道射頻收發器參考設計
This reference design, an 8-channel analog front end (AFE), is demonstrated using two AFE7444 4-channel RF transceivers and a LMK04828-LMX2594 based clocking subsystem which can enable designs to scale to 16 or more channels. Each AFE channel consists of a 14-bit, 9-GSPS DAC and a 3-GSPS ADC that (...)
封裝 | 引腳 | 下載 |
---|---|---|
PDIP (N) | 20 | 檢視選項 |
SOIC (DW) | 20 | 檢視選項 |
SOP (NS) | 20 | 檢視選項 |
SSOP (DB) | 20 | 檢視選項 |
TSSOP (PW) | 20 | 檢視選項 |
TVSOP (DGV) | 20 | 檢視選項 |
VQFN (RGY) | 20 | 檢視選項 |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點