首頁 放大器 全差分放大器
首頁
放大器
全差分放大器

THS4541-DIE

現行

裸晶 850-MHz 精密全差動放大器

立即訂購
產品規格表

THS4541-DIE

現行
產品規格表 立即訂購

產品詳細資料

Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.7 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.4 BW at Acl (MHz) 620 Acl, min spec gain (V/V) 1 Slew rate (typ) (V/µs) 1500 Architecture Bipolar, Fully Differential ADC Driver Vn at flatband (typ) (nV√Hz) 2.2 Iq per channel (typ) (mA) 10.1 Rail-to-rail In to V-, Out Vos (offset voltage at 25°C) (max) (mV) 0.45 Operating temperature range (°C) -40 to 125 Iout (typ) (mA) 100 2nd harmonic (dBc) 140 3rd harmonic (dBc) 140 Frequency of harmonic distortion measurement (MHz) 0.1 GBW (typ) (MHz) 850 Input bias current (max) (pA) 13000000 Features Shutdown CMRR (typ) (dB) 100 Rating Catalog
Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.7 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.4 BW at Acl (MHz) 620 Acl, min spec gain (V/V) 1 Slew rate (typ) (V/µs) 1500 Architecture Bipolar, Fully Differential ADC Driver Vn at flatband (typ) (nV√Hz) 2.2 Iq per channel (typ) (mA) 10.1 Rail-to-rail In to V-, Out Vos (offset voltage at 25°C) (max) (mV) 0.45 Operating temperature range (°C) -40 to 125 Iout (typ) (mA) 100 2nd harmonic (dBc) 140 3rd harmonic (dBc) 140 Frequency of harmonic distortion measurement (MHz) 0.1 GBW (typ) (MHz) 850 Input bias current (max) (pA) 13000000 Features Shutdown CMRR (typ) (dB) 100 Rating Catalog
DIESALE (Y) — See data sheet
  • Bandwidth: 500 MHz (G = 2 V/V)
  • Gain bandwidth product: 850 MHz
  • Slew rate: 1500 V/µs
  • HD2: –95 dBc at 10 MHz (2 VPP, RL = 500 Ω)
  • HD3: –90 dBc at 10 MHz (2 VPP, RL = 500 Ω)
  • Input voltage noise: 2.2 nV/ √Hz (f > 100 kHz)
  • Low offset drift: ±0.5 µV/°C (typical)
  • Negative rail input (NRI)
  • Rail-to-rail output (RRO)
  • Power supply:
    • Single-supply voltage range: 2.7 V to 5.4 V
    • Split-supply voltage range: ±1.35 V to ±2.7 V
    • Quiescent current: 10.1 mA (5-V supply)
  • Power-down capability: 2 µA (typical)
  • Bandwidth: 500 MHz (G = 2 V/V)
  • Gain bandwidth product: 850 MHz
  • Slew rate: 1500 V/µs
  • HD2: –95 dBc at 10 MHz (2 VPP, RL = 500 Ω)
  • HD3: –90 dBc at 10 MHz (2 VPP, RL = 500 Ω)
  • Input voltage noise: 2.2 nV/ √Hz (f > 100 kHz)
  • Low offset drift: ±0.5 µV/°C (typical)
  • Negative rail input (NRI)
  • Rail-to-rail output (RRO)
  • Power supply:
    • Single-supply voltage range: 2.7 V to 5.4 V
    • Split-supply voltage range: ±1.35 V to ±2.7 V
    • Quiescent current: 10.1 mA (5-V supply)
  • Power-down capability: 2 µA (typical)

The THS4541-DIE is a low-power, voltage-feedback, fully differential amplifier (FDA) with an input common-mode range below the negative rail, and rail-to-rail output. This is a bare die product that can be used in multi-chip modules (MCM), system-in-package (SiP), chip-on-board (COB), hybrids, and systems that require an extremely small size. The THS4541-DIE is designed for low-power data acquisition systems where high density is critical in a high-performance analog-to-digital converter (ADC) or digital-to-analog converter (DAC) interface design.

The THS4541-DIE features the negative-rail input required when interfacing a DC-coupled, ground-centered, source signal. This negative-rail input, with rail-to-rail output, allows for easy interface between single-ended, ground-referenced, bipolar signal sources and a wide variety of successive approximation register (SAR), delta-sigma (ΔΣ), or pipeline ADCs using only a single 2.7 V to 5.4 V power supply.

The THS4541-DIE is a low-power, voltage-feedback, fully differential amplifier (FDA) with an input common-mode range below the negative rail, and rail-to-rail output. This is a bare die product that can be used in multi-chip modules (MCM), system-in-package (SiP), chip-on-board (COB), hybrids, and systems that require an extremely small size. The THS4541-DIE is designed for low-power data acquisition systems where high density is critical in a high-performance analog-to-digital converter (ADC) or digital-to-analog converter (DAC) interface design.

The THS4541-DIE features the negative-rail input required when interfacing a DC-coupled, ground-centered, source signal. This negative-rail input, with rail-to-rail output, allows for easy interface between single-ended, ground-referenced, bipolar signal sources and a wide variety of successive approximation register (SAR), delta-sigma (ΔΣ), or pipeline ADCs using only a single 2.7 V to 5.4 V power supply.
open-in-new 尋找其它 全差分放大器
下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 2
類型 標題 日期
* Data sheet THS4541-DIE Negative Rail Input, Rail-to-Rail Output, Precision, 850-MHz Fully Differential Amplifier datasheet (Rev. A) PDF | HTML 2022年 3月 11日
Application note Noise Analysis for High Speed Op Amps (Rev. A) 2005年 1月 17日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

THS4541RGTEVM — 採用 RGT 封裝的 THS4541 評估模組

The THS4541RGT EVM is an evaluation module for the single THS4541 amplifier in the RGT package. This evaluation module is designed to quickly and easily demonstrate the functionality and versatility of the amplifier. The EVM is ready to connect to power, signal source, and test instruments (...)

使用指南: PDF
TI.com 無法提供
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
要求
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
檢視選項
封裝 引腳 下載
DIESALE (Y) —
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片