TMUX6122
- Wide supply range: ±5 V to ±16.5 V (dual) or 10 V to 16.5 V (single)
- Latch-up performance meets 100 mA per JESD78 Class II Level A on all pins
- Low on-capacitance: 4.2 pF
- Low input leakage: 0.5 pA
- Low charge injection: 0.51 pC
- Rail-to-rail operation
- Low on-resistance: 120 Ω
- Fast switch turn-on time: 68 ns
- Break-before-make switching (TMUX6123)
- SELx pin connectable to VDD with integrated pull-down
- Logic levels: 2 V to VDD
- Low supply current: 16 µA
- Human Body Model (HBM) ESD protection: ± 2 kV on all pins
- Industry-standard VSSOP package
The TMUX6121, TMUX6122, and TMUX6123 are modern complementary metal-oxide semiconductor (CMOS) devices that have two independently selectable single-pole, single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL and CMOS logic compatibility.
The switches are turned on with Logic 1 on the digital control inputs in the TMUX6121. Logic 0 is required to turn on switches in the TMUX6122. The TMUX6123 has one switch with similar digital control logic to the TMUX6121 while the logic is inverted on the other switch. The TMUX6123 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.
The TMUX6121, TMUX6122, and TMUX6123 are part of the precision switches and multiplexers family of devices. The devices have very low leakage current and low charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 16 µA enables the device usage in portable applications.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TMUX612x ±16.5-V, Low-Capacitance, Low-Leakage-Current, Precision, Dual SPST Switches datasheet (Rev. A) | PDF | HTML | 2022年 7月 26日 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 2022年 5月 13日 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
| Application note | System Level Protection for High Voltage Analog Multiplexers | 2017年 1月 3日 |
設計與開發
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LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| 封裝 | 引腳 | 下載 |
|---|---|---|
| VSSOP (DGS) | 10 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
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- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
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