TPA2031D1
- Pin-to-Pin Compatibility with TPA2010D1
- 32 ms Start-up Time Eliminates CODEC Click/Pop noise
- Maximum Battery Life and Minimum Heat
- Efficiency With an 8-Ω Speaker:
- 88% at 400 mW
- 2.8-mA Quiescent Current
- 0.5-µA Shutdown Current
- Efficiency With an 8-Ω Speaker:
- Only Three External Components
- Optimized PWM Output Stage Eliminates LC Output Filter
- Improved PSRR (-75 dB) and Wide Supply Voltage (2.5 V to 5.5 V) Eliminates Need for a Voltage Regulator
- Fully Differential Design Reduces RF Rectification and Eliminates Bypass Capacitor
- Improved CMRR Eliminates Two Input Coupling Capacitors
- Wafer Chip Scale Packaging (WCSP)
- NanoFree™ (YZF)
- APPLICATIONS
- Ideal for Wireless or Cellular Handsets and PDAs
The TPA2031D1 is a 2.5-W high efficiency filter-free class-D audio power amplifier in a 1,45 mm × 1,45 mm wafer chip scale package (WCSP) that requires only three external components.
Features like 88% efficiency, -75-dB PSRR, improved RF-rectification immunity, and 8 mm2 total PCB area make the TPA2031D1 class-D amp ideal for cellular handsets. 32 ms start-up time allows the TPA2031D1 to share the same GPIO enable/shutdown control as the CODEC without passing through the CODEC turn-on pop.
In cellular handsets, the earpiece, speaker phone, and melody ringer can each be driven by the TPA2031D1. The TPA2031D1 allows independent gain while summing signals from separate sources, and has a low 36 µV noise floor, A-weighted.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 2.5-W Mono Filter-Free Class-D Audio Power Amplifier datasheet | 2008年 5月 28日 | |
User guide | TPA2031D1EVM User's Guide | 2008年 5月 28日 |
設計與開發
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TPA2031D1EVM — TPA2031D1 評估模組 (EVM)
The TPA2031D1 audio power amplifier evaluation module is a complete, low-power single-channel audio power amplifier. It consists of the TI TPA2031D1 2.5-W low-voltage Class-D audio power amplifier IC in a very small NanoFree WCSP package, along with a small number of other parts mounted on a (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 引腳 | 下載 |
---|---|---|
DSBGA (YZF) | 9 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點