TPA3001D1
- 20 W Into 8- Load From 18-V Supply (10% THD+N)
- Short-Circuit Protection (Short to VCC, Short to GND,
Short Between Outputs) - Third-Generation Modulation Technique:
- Replaces Large LC Filter With Small, Low-Cost Ferrite
Bead Filter in Most Applications - Improved Efficiency
- Improved SNR
- Replaces Large LC Filter With Small, Low-Cost Ferrite
- Low Supply Current: 8 mA Typ at 12 V
- Shutdown Control: < 1 µA Typ
- Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
- APPLICATIONS
- LCD Monitors/TVs
- Hands-Free Car Kits
- Powered Speakers
PowerPAD Is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners
The TPA3001D1 (sometimes referred to as TPA3001) is a 20-W monaural bridge-tied load (BTL) class-D audio power amplifier (class-D amp) with high efficiency, eliminating the need for heat sinks. The TPA3001D1 can drive 4- or 8- speakers with only a ferrite bead filter required to reduce EMI.
The gain of the amplifier is controlled by two input terminals, GAIN1 and GAIN0. This allows the amplifier to be configured for a gain of 12, 18, 23.6, or 36 dB. The differential input stage provides high common-mode rejection and improved power-supply rejection.
The amplifier also includes depop circuitry to reduce the amount of pop at power-up and when cycling SHUTDOWN.
The TPA3001D1 (TPA3001) is available in the 24-pin thermally enhanced TSSOP package (PWP), which eliminates the need for an external heat sink.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 20W Mono Class-D Audio Power Amplifier datasheet (Rev. E) | 2010年 8月 23日 | |
Application note | Layout Guidelines For TPA300x Series Parts (Rev. A) | 2020年 6月 24日 | ||
Application note | Using Thermal Calculation Tools for Analog Components (Rev. A) | 2019年 8月 30日 | ||
Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||
Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 | ||
Application note | AN-1737 Managing EMI in Class D Audio Applications (Rev. A) | 2013年 5月 1日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 引腳 | 下載 |
---|---|---|
HTSSOP (PWP) | 24 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點