TPD3F303
- Bidirectional EMI Filtering and Line Termination
With Integrated ESD Protection- –3-dB Bandwidth 300 MHz
- IEC 61000-4-2 Level 4 ESD Protection
- ±15-kV Contact Discharge
- ±15-kV Air Gap Discharge
- DC Breakdown Voltage: 6 V (Minimum)
- Low Leakage Current: 0.1 µA (Maximum)
- Low Noise C-R-C Filter Topology
- Integrated VCC Clamp Eliminates the Need for
External ESD Protection - Space-Saving DPV (0.5-mm Pitch), DQD
Packages (0.4-mm Pitch)
The TPD3F303 device is a highly-integrated device that provides a three-channel Electromagnetic Interference (EMI) filter and a Transient Voltage Suppressor (TVS) based ESD protection diode array. The C-R-C based low-pass filter provides EMI protection for the data, clock, and reset lines of a SIM Card interface. Furthermore, the four-channel TVS Diode array provides IEC 61000-4-2 level 4 ESD protection for the previously mentioned signals (data, clock, reset) and the VCC power line. The TPD3F303 contains a 47-Ω termination resistor for the clock line and 100-Ω termination resistor for both the data and reset lines. The high level of integration offered by the TPD3F303 makes the device well-suited for applications like cell phones, tablets, hotspots, and PDAs.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPD3F303 ESD Protection and EMI Filter for SIM Card Interface datasheet (Rev. A) | PDF | HTML | 2016年 4月 27日 |
| User guide | Reading and Understanding an ESD Protection Data Sheet (Rev. A) | PDF | HTML | 2023年 9月 19日 | |
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 | |
| Analog Design Journal | Design Considerations for System-Level ESD Circuit Protection | 2012年 9月 25日 |
設計與開發
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ESDEVM — 通用 ESD 評估模組
<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 引腳 | 下載 |
|---|---|---|
| USON (DPV) | 8 | 檢視選項 |
| WSON (DQD) | 8 | 檢視選項 |
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