TPS65951

現行

整合式電源管理 IC (PMIC) 音訊轉碼器矽片

產品詳細資料

Regulated outputs (#) 14 Configurability Factory programmable Vin (min) (V) 2.7 Vin (max) (V) 5.5 Vout (min) (V) 0.6 Vout (max) (V) 3.15 Iout (max) (A) 1.4 Features Comm control, Power sequencing TI functional safety category Functional Safety-Capable Step-up DC/DC converter 0 Step-down DC/DC converter 3 Step-down DC/DC controller 0 Step-up DC/DC controller 0 LDO 11 Iq (typ) (mA) 0.03 Rating Catalog Operating temperature range (°C) -40 to 85 Processor supplier Texas Instruments Processor name OMAP Switching frequency (typ) (kHz) 3200 Product type Processor and FPGA
Regulated outputs (#) 14 Configurability Factory programmable Vin (min) (V) 2.7 Vin (max) (V) 5.5 Vout (min) (V) 0.6 Vout (max) (V) 3.15 Iout (max) (A) 1.4 Features Comm control, Power sequencing TI functional safety category Functional Safety-Capable Step-up DC/DC converter 0 Step-down DC/DC converter 3 Step-down DC/DC controller 0 Step-up DC/DC controller 0 LDO 11 Iq (typ) (mA) 0.03 Rating Catalog Operating temperature range (°C) -40 to 85 Processor supplier Texas Instruments Processor name OMAP Switching frequency (typ) (kHz) 3200 Product type Processor and FPGA
NFBGA (ZWS) 169 144 mm² 12 x 12
  • Power:
    • Three Efficient Step-down Converters
    • 10 External Linear LDOs for Clocks and Peripherals
    • SmartReflex Dynamic Voltage Management
  • Audio:
    • Voice Codec
    • 15-Bit Linear Codec (8 and 16 kHz)
    • Differential Input Main and Submicrophones
    • Differential Headset Microphone Input
    • Auxiliary/FM Input (Mono or Stereo)
    • Differential 32-Ω Speaker and 16-Ω Headset Drivers (External Predrivers for Class D)
    • 8-Ω Stereo Class-D Drivers
    • Pulse Code Modulation (PCM) and TDM Interfaces
    • Interface
    • Automatic Level Control (ALC)
    • Digital and Analog Mixing
    • 16-Bit Linear Audio Stereo DAC (96, 48, 44.1, and 32 kHz, and Derivatives)
    • 16-Bit Linear Audio Stereo ADC (48, 44.1, and 32 kHz, and Derivatives)
    • Carkit
  • Charger:
    • Li-ion, Li-on Polymer, and Cobalt-Nickel-Manganese Charger
    • Backup Battery Charger
  • USB:
    • USB 2.0 OTG-Compliant HS Transceivers
    • 12-Bit ULPI
    • USB Power Supply (5-V CP for VBUS)
    • CEA-2011: OTG Transceiver Interface Specification
    • CEA-936A: Mini-USB Analog Carkit Interface Specification
  • Additional Features:
    • LED Driver Circuit for Two External LEDs
    • RTC and Retention Modules
    • HS Inter-Integrated Circuit (I2C) Serial Control
    • Thermal Shutdown and Hot-Die Detection
    • External Vibrator (Vibrator) Control
    • 19 GPIO Devices
    • 0.8-mm Pitch, 169-Pin, 12-mm × 12-mm Package
  • Power:
    • Three Efficient Step-down Converters
    • 10 External Linear LDOs for Clocks and Peripherals
    • SmartReflex Dynamic Voltage Management
  • Audio:
    • Voice Codec
    • 15-Bit Linear Codec (8 and 16 kHz)
    • Differential Input Main and Submicrophones
    • Differential Headset Microphone Input
    • Auxiliary/FM Input (Mono or Stereo)
    • Differential 32-Ω Speaker and 16-Ω Headset Drivers (External Predrivers for Class D)
    • 8-Ω Stereo Class-D Drivers
    • Pulse Code Modulation (PCM) and TDM Interfaces
    • Interface
    • Automatic Level Control (ALC)
    • Digital and Analog Mixing
    • 16-Bit Linear Audio Stereo DAC (96, 48, 44.1, and 32 kHz, and Derivatives)
    • 16-Bit Linear Audio Stereo ADC (48, 44.1, and 32 kHz, and Derivatives)
    • Carkit
  • Charger:
    • Li-ion, Li-on Polymer, and Cobalt-Nickel-Manganese Charger
    • Backup Battery Charger
  • USB:
    • USB 2.0 OTG-Compliant HS Transceivers
    • 12-Bit ULPI
    • USB Power Supply (5-V CP for VBUS)
    • CEA-2011: OTG Transceiver Interface Specification
    • CEA-936A: Mini-USB Analog Carkit Interface Specification
  • Additional Features:
    • LED Driver Circuit for Two External LEDs
    • RTC and Retention Modules
    • HS Inter-Integrated Circuit (I2C) Serial Control
    • Thermal Shutdown and Hot-Die Detection
    • External Vibrator (Vibrator) Control
    • 19 GPIO Devices
    • 0.8-mm Pitch, 169-Pin, 12-mm × 12-mm Package

The TPS65951 device is a power-management IC for mobile cellular handsets powered by a Li-ion, Li-ion polymer, or cobalt-nickel-manganese cell battery. The device can be connected to an application processor and/or a modem. This optimized power-management IC is designed to support the specific power requirements of the OMAP processor devices. The TPS65951 contains several buck converters, low dropout (LDO) regulators, a battery charger interface, and a host of other features and functions. The audio portion of the TPS65951 is an entire audio module with audio codecs, digital filters, input preamplifiers and amplifiers, and class-D output amplifiers.

This TPS65951 Data Manual presents the electrical and mechanical specifications for the TPS65951 device.

The TPS65951 device is a power-management IC for mobile cellular handsets powered by a Li-ion, Li-ion polymer, or cobalt-nickel-manganese cell battery. The device can be connected to an application processor and/or a modem. This optimized power-management IC is designed to support the specific power requirements of the OMAP processor devices. The TPS65951 contains several buck converters, low dropout (LDO) regulators, a battery charger interface, and a host of other features and functions. The audio portion of the TPS65951 is an entire audio module with audio codecs, digital filters, input preamplifiers and amplifiers, and class-D output amplifiers.

This TPS65951 Data Manual presents the electrical and mechanical specifications for the TPS65951 device.

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類型 標題 日期
* Data sheet TPS65951 Integrated Power Management/Audio Codec Silicon Revision 1.0 DM datasheet (Rev. G) 2014年 9月 29日
* Errata TPS65951 Silicon Errata 2010年 9月 20日
User guide IPM MicroStar BGA Discontinued and Redesigned 2020年 11月 3日
Selection guide Power Management Guide 2018 (Rev. R) 2018年 6月 25日
Application note Feature Differences between TPS65950 and TPS65951 2010年 9月 1日

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模擬型號

TPS65951 BSDL Models

SWCC011.ZIP (3 KB) - BSDL Model
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NFBGA (ZWS) 169 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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