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Power modules (integrated inductor)

TPS82697

現行

800-mA 高效 MicroSiP™ 降壓轉換器 (尺寸 <1mm)。

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產品規格表

TPS82697

現行
產品規格表 立即訂購

產品詳細資料

Iout (max) (A) 0.8 Vin (max) (V) 4.8 Vin (min) (V) 2.3 Vout (max) (V) 2.8 Vout (min) (V) 2.8 Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Features Enable, Spread Spectrum Control mode Constant on-time (COT) Switching frequency (max) (Hz) 3300000 Switching frequency (min) (Hz) 2700000
Iout (max) (A) 0.8 Vin (max) (V) 4.8 Vin (min) (V) 2.3 Vout (max) (V) 2.8 Vout (min) (V) 2.8 Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Features Enable, Spread Spectrum Control mode Constant on-time (COT) Switching frequency (max) (Hz) 3300000 Switching frequency (min) (Hz) 2700000
uSIP (SIP) 8 6.67 mm² 2.3 x 2.9
  • Total Solution Size < 6.7 mm2
  • 95% Efficiency at 3-MHz Operation
  • 23µA Quiescent Current
  • High Duty-Cycle Operation
  • Best in Class Load and Line Transient
  • ±2% Total DC Voltage Accuracy
  • Automatic PFM/PWM Mode Switching
  • Low Ripple Light-Load PFM Mode
  • Excellent AC Load Regulation
  • Internal Soft Start, 200-µs Start-Up Time
  • Integrated Active Power-Down Sequencing (Optional)
  • Current Overload and Thermal Shutdown Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size < 6.7 mm2
  • 95% Efficiency at 3-MHz Operation
  • 23µA Quiescent Current
  • High Duty-Cycle Operation
  • Best in Class Load and Line Transient
  • ±2% Total DC Voltage Accuracy
  • Automatic PFM/PWM Mode Switching
  • Low Ripple Light-Load PFM Mode
  • Excellent AC Load Regulation
  • Internal Soft Start, 200-µs Start-Up Time
  • Integrated Active Power-Down Sequencing (Optional)
  • Current Overload and Thermal Shutdown Protection
  • Sub 1-mm Profile Solution

The TPS8269xSIP device is a complete 500 mA / 800 mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design. The TPS8269xSIP is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSIP™ DC/DC converter operates at a regulated 3-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range. The PFM mode extends the battery life by reducing the quiescent current to 23 µA (typical) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency. The TPS8269xSIP is packaged in a compact (2.9 mm × 2.3 mm) and low profile (1 mm) BGA package suitable for automated assembly by standard surface mount equipment.

The TPS8269xSIP device is a complete 500 mA / 800 mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design. The TPS8269xSIP is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSIP™ DC/DC converter operates at a regulated 3-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range. The PFM mode extends the battery life by reducing the quiescent current to 23 µA (typical) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency. The TPS8269xSIP is packaged in a compact (2.9 mm × 2.3 mm) and low profile (1 mm) BGA package suitable for automated assembly by standard surface mount equipment.
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類型 標題 日期
* Data sheet TPS8269x High-Efficiency MicroSIP Step-Down Converter (Profile <1 mm) datasheet (Rev. C) PDF | HTML 2015年 4月 1日
Selection guide Innovative DC/DC Power Modules Selection Guide (Rev. D) 2021年 10月 14日
User guide Manufacturing and Rework Design Guide for MicroSiP™ Power Modules (Rev. A) PDF | HTML 2021年 6月 16日
Analog Design Journal Understanding 100% mode in low-power DC/DC converters 2018年 6月 22日
Analog Design Journal Testing tips for applying external power to supply outputs without an input voltage 2016年 10月 24日
White paper SiP Power Modules White Paper 2016年 1月 26日
Analog Design Journal IQ: What it is, what it isn’t, and how to use it 2011年 6月 17日

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