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TPSI2140-Q1

現行

具有 2-mA 雪崩擊穿額定值的車用 1200-V、50-mA 隔離開關

產品詳細資料

Withstand isolation voltage (VISO) (Vrms) 3750 FET Internal Number of channels 1 Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 20 Imax (A) 0.05 Features 2-mA avalanche current, Capacitive isolation TI functional safety category Functional Safety-Capable Operating temperature range (°C) -40 to 125 Turnon time (enable) (ns) 70000 Turnoff time (disable) (ns) 100000 OFF-state leakage current (µA) 3.5 Rating Automotive Isolation rating Basic CMTI (min) (kV/µs) 100 Working isolation voltage (VIOWM) (Vrms) 1500 Surge isolation voltage (VIOSM) (VPK) 5000 Transient isolation voltage (VIOTM) (VPK) 5300 Creepage (min) (mm) 8 Clearance (min) (mm) 8
Withstand isolation voltage (VISO) (Vrms) 3750 FET Internal Number of channels 1 Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 20 Imax (A) 0.05 Features 2-mA avalanche current, Capacitive isolation TI functional safety category Functional Safety-Capable Operating temperature range (°C) -40 to 125 Turnon time (enable) (ns) 70000 Turnoff time (disable) (ns) 100000 OFF-state leakage current (µA) 3.5 Rating Automotive Isolation rating Basic CMTI (min) (kV/µs) 100 Working isolation voltage (VIOWM) (Vrms) 1500 Surge isolation voltage (VIOSM) (VPK) 5000 Transient isolation voltage (VIOTM) (VPK) 5300 Creepage (min) (mm) 8 Clearance (min) (mm) 8
SOIC (DWQ) 11 106.09 mm² 10.3 x 10.3
  • Qualified for automotive applications
    • AEC-Q100 grade 1: –40 to 125°C T A
  • Integrated avalanche rated MOSFETs
    • Designed and qualified for reliability during overvoltage conditions, including system level dielectric withstand testing (Hi-Pot)
      • I AVA = 2-mA for 5-s pulses, 1-mA for 60-s pulses
    • 1200-V standoff voltage
    • R ON = 130-Ω (T J = 25°C)
    • T ON, T OFF < 700-µs
  • Low primary side supply current
    • 9-mA ON state current
    • 3.5-µA OFF state current
  • Functional Safety Capable
  • Robust isolation barrier:
    • > 26 year projected lifetime at 1000-V RMS / 1500-V DC working voltage
    • Isolation rating, V ISO, up to 3750-V RMS / 5300-V DC
    • Peak surge, V IOSM, up to 5000-V
    • ± 100-V/ns typical CMTI
  • SOIC 11-pin (DWQ) package with wide pins for improved thermal performance
    • Creepage and clearance ≥ 8-mm (primary-secondary)
    • Creepage and clearance ≥ 6-mm (across switch terminals)
  • Safety-related certifications
    • (Planned) DIN VDE V 0884-11:2017-01
    • (Planned) UL 1577 component recognition program
  • Qualified for automotive applications
    • AEC-Q100 grade 1: –40 to 125°C T A
  • Integrated avalanche rated MOSFETs
    • Designed and qualified for reliability during overvoltage conditions, including system level dielectric withstand testing (Hi-Pot)
      • I AVA = 2-mA for 5-s pulses, 1-mA for 60-s pulses
    • 1200-V standoff voltage
    • R ON = 130-Ω (T J = 25°C)
    • T ON, T OFF < 700-µs
  • Low primary side supply current
    • 9-mA ON state current
    • 3.5-µA OFF state current
  • Functional Safety Capable
  • Robust isolation barrier:
    • > 26 year projected lifetime at 1000-V RMS / 1500-V DC working voltage
    • Isolation rating, V ISO, up to 3750-V RMS / 5300-V DC
    • Peak surge, V IOSM, up to 5000-V
    • ± 100-V/ns typical CMTI
  • SOIC 11-pin (DWQ) package with wide pins for improved thermal performance
    • Creepage and clearance ≥ 8-mm (primary-secondary)
    • Creepage and clearance ≥ 6-mm (across switch terminals)
  • Safety-related certifications
    • (Planned) DIN VDE V 0884-11:2017-01
    • (Planned) UL 1577 component recognition program

The TPSI2140-Q1 is an isolated solid state relay designed for high voltage automotive and industrial applications. The TPSI2140-Q1 uses TI’s high reliability capacitive isolation technology in combination with internal back-to-back MOSFETs to form a completely integrated solution requiring no secondary side power supply.

The primary side of the device is powered by only 9 mA of input current and incorporates a fail-safe EN pin preventing any possibility of back powering the VDD supply. In most applications, the VDD pin of the device should be connected to a system supply between 5 V–20 V and the EN pin of the device should be driven by a GPIO output with logic HI between 2.1 V–20 V. In other applications, The VDD and EN pins could be driven together directly from the system supply or from a GPIO output. All control configurations of the TPSI2140-Q1 do not require additional external components such as a resistor and/or low side switch that are typically required in photo relay solutions.

The secondary side consists of back-to-back MOSFETs with a standoff voltage of ±1.2 kV from S1 to S2. The TPSI2140-Q1 MOSFET’s avalanche robustness and thermally conscious package design allow it to robustly support system level dielectric withstand testing (HiPot) and DC fast charger surge currents of up to 2 mA without requiring any external components.

The TPSI2140-Q1 is an isolated solid state relay designed for high voltage automotive and industrial applications. The TPSI2140-Q1 uses TI’s high reliability capacitive isolation technology in combination with internal back-to-back MOSFETs to form a completely integrated solution requiring no secondary side power supply.

The primary side of the device is powered by only 9 mA of input current and incorporates a fail-safe EN pin preventing any possibility of back powering the VDD supply. In most applications, the VDD pin of the device should be connected to a system supply between 5 V–20 V and the EN pin of the device should be driven by a GPIO output with logic HI between 2.1 V–20 V. In other applications, The VDD and EN pins could be driven together directly from the system supply or from a GPIO output. All control configurations of the TPSI2140-Q1 do not require additional external components such as a resistor and/or low side switch that are typically required in photo relay solutions.

The secondary side consists of back-to-back MOSFETs with a standoff voltage of ±1.2 kV from S1 to S2. The TPSI2140-Q1 MOSFET’s avalanche robustness and thermally conscious package design allow it to robustly support system level dielectric withstand testing (HiPot) and DC fast charger surge currents of up to 2 mA without requiring any external components.

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類型 標題 日期
* Data sheet TPSI2140-Q1 1200-V, 50-mA, Automotive Isolated Switch With 2-mA Avalanche Rating datasheet (Rev. B) PDF | HTML 2023年 6月 2日
White paper 設計更安全、更智慧且更緊密相連的電池管理系統 PDF | HTML 2024年 1月 24日
Technical article How solid-state relays simplify insulation monitoring designs in high-voltage applications PDF | HTML 2024年 1月 4日
Functional safety information TPSI2140-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA (Rev. A) PDF | HTML 2023年 6月 14日
EVM User's guide TPSI2140-Q1 Evaluation Module User's Guide (Rev. A) PDF | HTML 2023年 6月 5日
Product overview When to use SSR or Isolated Gate Driver PDF | HTML 2022年 8月 4日
Technical article How to design high-voltage systems with higher reliability while reducing solution PDF | HTML 2022年 6月 8日
Technical article How to achieve higher-reliability isolation and a smaller solution size with solid PDF | HTML 2022年 5月 9日
Certificate TPSI2140Q1EVM EU RoHS Declaration of Conformity (DoC) (Rev. A) 2022年 4月 5日

設計與開發

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開發板

TPSI2140Q1EVM — TPSI2140-Q1 評估模組,適用具有 2-mA 雪崩擊穿額定值的 1200-V、50-mA 隔離開關

TPSI2140Q1EVM 評估模組是包含多個測試點和跳線的雙銅層電路板,以全面評估裝置功能。

使用指南: PDF | HTML
TI.com 無法提供
模擬工具

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模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
參考設計

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Design guide: PDF
參考設計

TIDA-01513 — 車用高電壓與隔離洩漏測量參考設計

The function of this reference design is to monitor the isolation resistance of a high-voltage bus to the chassis ground. Monitoring the isolation strength of coupling devices and components from high voltage to the chassis ground is a necessary feature in HEV’s and EV’s as battery (...)
Design guide: PDF
電路圖: PDF
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  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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