TS12A44513
- 2-V to 12-V Single-Supply Operation
- Specified ON-State Resistance:
- 15-Ω Maximum With 12-V Supply
- 20-Ω Maximum With 5-V Supply
- 50-Ω Maximum With 3.3-V Supply
- ΔRON Matching
- 2.5-Ω (Max) at 12 V
- 3-Ω (Max) at 5 V
- 3.5-Ω (Max) at 3.3 V
- Specified Low OFF-Leakage Currents:
- 1 nA at 25°C
- 10 nA at 85°C
- Specified Low ON-Leakage Currents:
- 1 nA at 25°C
- 10 nA at 85&25;C
- Low Charge Injection: 11.5 pC (12-V Supply)
- Fast Switching Speed:
tON = 80 ns, tOFF = 50 ns
(12-V Supply) - Break-Before-Make Operation (tON > tOFF)
- TTL/CMOS-Logic Compatible With 5-V Supply
- Available in 14-Pin TSSOP Package or 14-Pin
SOIC Package
The TS12A44513, TS12A44514, and TS12A44515 devices have four bidirectional single-pole single-throw (SPST) single-supply CMOS analog switches. The TS12A44513 has two normally closed (NC) switches and two normally open (NO) switches, the TS12A44514 has four NO switches, and the TS12A44515 has four NC switches.
These CMOS switches may operate continuously with a single supply from 2 V to 12 V and can handle rail-to-rail analog signals. The OFF-leakage current maximum is only 1 nA at 25°C or 10 nA at 85°C.
When using a 5-V supply, all digital inputs have 0.8-V to 2.4-V logic thresholds, ensuring TTL/CMOS-logic compatibility.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TS12A4451x Low ON-State Resistance 4-Channel SPST CMOS Analog Switches datasheet (Rev. B) | PDF | HTML | 2016年 2月 1日 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
| Application note | Preventing Excess Power Consumption on Analog Switches | 2008年 7月 3日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
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LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| 封裝 | 引腳 | 下載 |
|---|---|---|
| SOIC (D) | 14 | 檢視選項 |
| TSSOP (PW) | 14 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。