產品詳細資料

Configuration 2:1 SPDT Number of channels 6 Power supply voltage - single (V) 1.8, 2.5, 3.3 Protocols Analog Ron (typ) (Ω) 4.4 CON (typ) (pF) 21.5 ON-state leakage current (max) (µA) 7 Supply current (typ) (µA) 0.001 Bandwidth (MHz) 240 Operating temperature range (°C) -40 to 85 Features 1.8-V compatible control inputs, Break-before-make, Powered-off protection Input/output continuous current (max) (mA) 50 Rating Catalog Drain supply voltage (max) (V) 3.6 Supply voltage (max) (V) 3.6
Configuration 2:1 SPDT Number of channels 6 Power supply voltage - single (V) 1.8, 2.5, 3.3 Protocols Analog Ron (typ) (Ω) 4.4 CON (typ) (pF) 21.5 ON-state leakage current (max) (µA) 7 Supply current (typ) (µA) 0.001 Bandwidth (MHz) 240 Operating temperature range (°C) -40 to 85 Features 1.8-V compatible control inputs, Break-before-make, Powered-off protection Input/output continuous current (max) (mA) 50 Rating Catalog Drain supply voltage (max) (V) 3.6 Supply voltage (max) (V) 3.6
TSSOP (PW) 24 49.92 mm² 7.8 x 6.4 WQFN (RTW) 24 16 mm² 4 x 4
  • 1.65 V to 3.6 V single-supply operation
  • Isolation in power-down mode, VCC = 0
  • Low-capacitance switches, 21.5 pF (typical)
  • Bandwidth up to 240 MHz for high-speed rail-to-rail signal handling
  • Crosstalk and OFF isolation of –62 dB
  • 1.8 V logic compatible control inputs
  • 3.6 V tolerant control inputs
  • Latch-up performance exceeds 100 mA per JESD 78, Class II
  • ESD performance tested per JESD 22
    • 2500-V human-body model (A114-B, Class II)
    • 1500-V charged-device model (C101)
  • ESD performance: NC/NO ports
    • ±6-kV contact discharge (IEC 61000-4-2)
  • 24-WQFN (4.00 mm × 4.00 mm) and 24-TSSOP (7.90 mm × 6.60 mm) packages
  • 1.65 V to 3.6 V single-supply operation
  • Isolation in power-down mode, VCC = 0
  • Low-capacitance switches, 21.5 pF (typical)
  • Bandwidth up to 240 MHz for high-speed rail-to-rail signal handling
  • Crosstalk and OFF isolation of –62 dB
  • 1.8 V logic compatible control inputs
  • 3.6 V tolerant control inputs
  • Latch-up performance exceeds 100 mA per JESD 78, Class II
  • ESD performance tested per JESD 22
    • 2500-V human-body model (A114-B, Class II)
    • 1500-V charged-device model (C101)
  • ESD performance: NC/NO ports
    • ±6-kV contact discharge (IEC 61000-4-2)
  • 24-WQFN (4.00 mm × 4.00 mm) and 24-TSSOP (7.90 mm × 6.60 mm) packages

The TS3A27518E is a bidirectional, 6-channel, 1:2 multiplexer-demultiplexer designed to operate from 1.65 V to 3.6 V. This device can handle both digital and analog signals, and can transmit signals up to VCC in either direction. The TS3A27518E has two control pins, each controlling three 1:2 muxes at the same time, and an enable pin that put all outputs in high-impedance mode. The control pins are compatible with 1.8 V logic thresholds and are backward compatible with 2.5 V and 3.3 V logic thresholds.

The TS3A27518E allows any SD, SDIO, and multimedia card host controllers to expand out to multiple cards or peripherals because the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. This device will support other 6-bit interfaces such a qSPI. The TS3A27518E has two control pins that give additional flexibility to the user. For example, the ability to mux two different audio-video signals in equipment such as an LCD television, an LCD monitor, or a notebook docking station.

The TS3A27518E is a bidirectional, 6-channel, 1:2 multiplexer-demultiplexer designed to operate from 1.65 V to 3.6 V. This device can handle both digital and analog signals, and can transmit signals up to VCC in either direction. The TS3A27518E has two control pins, each controlling three 1:2 muxes at the same time, and an enable pin that put all outputs in high-impedance mode. The control pins are compatible with 1.8 V logic thresholds and are backward compatible with 2.5 V and 3.3 V logic thresholds.

The TS3A27518E allows any SD, SDIO, and multimedia card host controllers to expand out to multiple cards or peripherals because the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. This device will support other 6-bit interfaces such a qSPI. The TS3A27518E has two control pins that give additional flexibility to the user. For example, the ability to mux two different audio-video signals in equipment such as an LCD television, an LCD monitor, or a notebook docking station.

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類型 標題 日期
* Data sheet TS3A27518E 6-Channel (qSPI), 1:2 Multiplexer and Demultiplexer with IntegratedIEC L-4 ESD and 1.8-V Logic Compatible Control Inputs datasheet (Rev. F) PDF | HTML 2021年 12月 9日
Application brief 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) PDF | HTML 2022年 7月 26日
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022年 6月 2日
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021年 12月 1日
Application brief Enabling SPI-Based Flash Memory Expansion by Using Multiplexers (Rev. B) PDF | HTML 2021年 10月 7日
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML 2021年 1月 6日
Application note Preventing Excess Power Consumption on Analog Switches 2008年 7月 3日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

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AWRL6432BOOST 是一款易於使用的 60GHz mmWave 感測器評估套件,適用於具有 FR4 型天線的 AWRL6432 裝置。此電路板可存取點雲資料及 USB 供電介面。

AWRL6432BOOST 支援與 DCA1000EVM 直接連接。此 ‌BoosterPack 由 mmWave 工具、示範和軟體支援,包括 mmWave 軟體開發套件 (MMWAVE-L-SDK) 和 Code Composer Studio™ 整合式開發環境 (IDE) (CCSTUDIO)。

可使用其他電路板來啟用其他功能。例如 DCA1000EVM 可存取感測器原始類比轉數位 (ADC) (...)

使用指南: PDF | HTML
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開發板

IWRL6432BOOST — 適用於單晶片 60GHz mmWave 低功耗感測器的 IWRL6432 BoosterPack™評估模組

IWRL6432BOOST 是一款易於使用的 60GHz mmWave 感測器評估套件,以具有板載 FR4 型天線的 IWRL6432 裝置為基礎。此電路板可存取點雲資料及 USB 供電介面。IWRL6432BOOST 支援與 DCA1000EVM 開發套件直接連接。

此套件由 mmWave 工具、示範和軟體支援,包括 mmWave 軟體開發套件 (MMWAVE-L-SDK) 和 Code Composer Studio™ 整合式開發環境 (IDE) (CCSTUDIO)。

可使用其他電路板來啟用其他功能。例如 DCA1000EVM 可存取感測器的原始類比轉數位 (ADC) 資料擷取。板載 (...)

使用指南: PDF | HTML
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介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

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模擬型號

HSPICE Model for TS3A27518

SCDM129.ZIP (126 KB) - HSpice Model
模擬型號

TS3A27518 IBIS Model

SCDM128.ZIP (101 KB) - IBIS Model
封裝 引腳 下載
TSSOP (PW) 24 檢視選項
WQFN (RTW) 24 檢視選項

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