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協定專用交換器與多工器

TS3L110

現行

3.3-V、2:1 (SPDT)、4 通道 10/100 Base-T LAN 交換器

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產品規格表

TS3L110

現行
產品規格表 立即訂購

產品詳細資料

Protocols 10 BASE-T, 100 BASE-T, LAN Configuration 2:1 SPDT Number of channels 4 Bandwidth (MHz) 500 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 4000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 700 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -26 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 5.5 CON (typ) (pF) 10.5 Off isolation (typ) (dB) -28 OFF-state leakage current (max) (µA) 1 Propagation delay time (µs) 0.00025 Ron (max) (mΩ) 8000 Ron channel match (max) (Ω) 0.9 RON flatness (typ) (Ω) 1 Turnoff time (disable) (max) (ns) 5 Turnon time (enable) (max) (ns) 7 VIH (min) (V) 2 VIL (max) (V) 0.8
Protocols 10 BASE-T, 100 BASE-T, LAN Configuration 2:1 SPDT Number of channels 4 Bandwidth (MHz) 500 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 4000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 700 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -26 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 5.5 CON (typ) (pF) 10.5 Off isolation (typ) (dB) -28 OFF-state leakage current (max) (µA) 1 Propagation delay time (µs) 0.00025 Ron (max) (mΩ) 8000 Ron channel match (max) (Ω) 0.9 RON flatness (typ) (Ω) 1 Turnoff time (disable) (max) (ns) 5 Turnon time (enable) (max) (ns) 7 VIH (min) (V) 2 VIL (max) (V) 0.8
SOIC (D) 16 59.4 mm² 9.9 x 6 SSOP (DBQ) 16 29.4 mm² 4.9 x 6 TSSOP (PW) 16 32 mm² 5 x 6.4 TVSOP (DGV) 16 23.04 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5
  • Wide bandwidth (BW = 500 MHz typical)
  • Low crosstalk (XTALK = –30 dB typical)
  • Bidirectional data flow with near-zero propagation delay
  • Low and flat ON-state resistance
    (ron = 4 Ω typical, ron(flat) = 1 Ω)
  • Switching on Data I/O Ports (0 to 5 V)
  • VCC Operating range from 3 V to 3.6 V
  • Ioff Supports partial power-down-mode operation
  • Data and control inputs have undershoot clamp diodes
  • Latch-up performance exceeds 100 mA Per
    JESD 78, class II
  • ESD Performance tested per JESD 22
    • 2000-V Human-body model
      (A114-B, class II)
    • 1000-V Charged-device model (C101)
  • Suitable for both 10 Base-T and 100 Base-T signaling
  • Wide bandwidth (BW = 500 MHz typical)
  • Low crosstalk (XTALK = –30 dB typical)
  • Bidirectional data flow with near-zero propagation delay
  • Low and flat ON-state resistance
    (ron = 4 Ω typical, ron(flat) = 1 Ω)
  • Switching on Data I/O Ports (0 to 5 V)
  • VCC Operating range from 3 V to 3.6 V
  • Ioff Supports partial power-down-mode operation
  • Data and control inputs have undershoot clamp diodes
  • Latch-up performance exceeds 100 mA Per
    JESD 78, class II
  • ESD Performance tested per JESD 22
    • 2000-V Human-body model
      (A114-B, class II)
    • 1000-V Charged-device model (C101)
  • Suitable for both 10 Base-T and 100 Base-T signaling

The TS3L110 local area network (LAN) switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input. When E is low, the switch is enabled, and the I port is connected to the Y port. When E is high, the switch is disabled, and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.

The TS3L110 device can be used to replace mechanical relays in LAN applications. This device has low and flat ON-state resistance (ron), wide bandwidth, and low crosstalk, making it suitable for 10/100 Base-T and various other LAN applications. The TS3L110 device can be used to route signals from a 10/100 Base-T Ethernet transceiver to the RJ-45 LAN connectors in laptops or in docking stations. This device is designed for low channel-to-channel skew and low crosstalk.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current does not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The TS3L110 local area network (LAN) switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input. When E is low, the switch is enabled, and the I port is connected to the Y port. When E is high, the switch is disabled, and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.

The TS3L110 device can be used to replace mechanical relays in LAN applications. This device has low and flat ON-state resistance (ron), wide bandwidth, and low crosstalk, making it suitable for 10/100 Base-T and various other LAN applications. The TS3L110 device can be used to route signals from a 10/100 Base-T Ethernet transceiver to the RJ-45 LAN connectors in laptops or in docking stations. This device is designed for low channel-to-channel skew and low crosstalk.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current does not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
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類型 標題 日期
* Data sheet TS3L110 Quad SPDT High-Bandwidth 10/100 Base-T LAN Switch Differential 8-Channel to 4-Channel Multiplexer/Demultiplexer datasheet (Rev. B) PDF | HTML 2019年 10月 10日
Application note Preventing Excess Power Consumption on Analog Switches 2008年 7月 3日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

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介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

使用指南: PDF
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介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
使用指南: PDF
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SOIC (D) 16 檢視選項
SSOP (DBQ) 16 檢視選項
TSSOP (PW) 16 檢視選項
TVSOP (DGV) 16 檢視選項
VQFN (RGY) 16 檢視選項
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