TS3USB30E
- VCC Operation at 3 V to 4.3 V
- D+/D– Pins Tolerate up to 5.25 V
- 1.8-V Compatible Control-Pin Inputs
- IOFF Supports Partial Power-Down-Mode
Operation - RON = 10 Ω Maximum
- ΔRON = 0.35 Ω Typical
- Cio(ON) = 7.5 pF Typical
- Low Power Consumption (1 µA Maximum)
- –3-dB Bandwidth = 900 MHz Typical
- Latch-Up Performance Exceeds
100 mA Per JESD 78, Class II(1) - ESD Performance Tested Per JESD 22
- 8000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 8000-V Human-Body Model
- ESD Performance I/O Port to GND(2)
- 15000-V Human-Body Model
- Packaged in 10-pin UQFN (1.4 mm × 1.8 mm)
The TS3USB30E is a high-bandwidth 1:2 switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs, or from two different hosts to one corresponding output. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).
The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8 mm × 1.4 mm) or a VSSOP package, and is characterized over the free-air temperature range of 40°C to 85°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | ESD-Protected, High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer/Demultiplexer Swit datasheet (Rev. F) | 2015年 8月 14日 | |
Application note | Passive Mux Selection Based On Bandwidth > Ron | 2019年 9月 11日 | ||
Application note | High-Speed Layout Guidelines for Signal Conditioners and USB Hubs | 2018年 6月 14日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 引腳 | 下載 |
---|---|---|
UQFN (RSW) | 10 | 檢視選項 |
VSSOP (DGS) | 10 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。