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類比交換器與多工器

TS5A23166

現行

0.9-Ω 低導通電阻、5-V、1:1 (SPST)、2 通道類比開關 (高電位作動)

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產品規格表

TS5A23166

現行
產品規格表 立即訂購

產品詳細資料

Configuration 1:1 SPST Number of channels 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 0.75 CON (typ) (pF) 35.5 ON-state leakage current (max) (µA) 0.05 Supply current (typ) (µA) 0.001 Bandwidth (MHz) 150 Operating temperature range (°C) -40 to 85 Features Powered-off protection Input/output continuous current (max) (mA) 200 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 1:1 SPST Number of channels 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 0.75 CON (typ) (pF) 35.5 ON-state leakage current (max) (µA) 0.05 Supply current (typ) (µA) 0.001 Bandwidth (MHz) 150 Operating temperature range (°C) -40 to 85 Features Powered-off protection Input/output continuous current (max) (mA) 200 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25 DSBGA (YZT) 8 1.9404 mm² 1.98 x 0.98 VSSOP (DCU) 8 6.2 mm² 2 x 3.1
  • Isolation in Powered-Down Mode, V+ = 0
  • Low ON-state resistance (0.9 Ω)
  • Control inputs are 5.5-V Tolerant
  • Low charge injection
  • Excellent ON-state resistance matching
  • Low total harmonic distortion (THD)
  • 1.65-V to 5.5-V Single-supply operation
  • Latch-up performance exceeds 100 mA
    per JESD 78, class II
  • ESD Performance tested per JESD 22
    • 2000-V Human-body model
      (A114-B, Class II)
    • 1000-V Charged-device model (C101)
  • Isolation in Powered-Down Mode, V+ = 0
  • Low ON-state resistance (0.9 Ω)
  • Control inputs are 5.5-V Tolerant
  • Low charge injection
  • Excellent ON-state resistance matching
  • Low total harmonic distortion (THD)
  • 1.65-V to 5.5-V Single-supply operation
  • Latch-up performance exceeds 100 mA
    per JESD 78, class II
  • ESD Performance tested per JESD 22
    • 2000-V Human-body model
      (A114-B, Class II)
    • 1000-V Charged-device model (C101)

The TS5A23166 device is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V to 5.5 V. The TS5A23166 device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance matching. The TS5A23166 device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.

The TS5A23166 device is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V to 5.5 V. The TS5A23166 device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance matching. The TS5A23166 device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.
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TS5A23167 現行 0.9-Ω 低導通電阻、5-V、1:1 (SPST)、2 通道類比開關 (低電位作動) Flipped logic polarity (normally closed)

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類型 標題 日期
* Data sheet TS5A23166 0.9-Ω Dual-SPST Analog Switch 5-V and 3.3-V 2-Channel Analog Switch datasheet (Rev. J) PDF | HTML 2019年 9月 18日
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022年 6月 2日
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021年 12月 1日
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML 2021年 1月 6日
Application note Preventing Excess Power Consumption on Analog Switches 2008年 7月 3日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

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介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

使用指南: PDF
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介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
使用指南: PDF
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模擬型號

HSPICE Model for TS5A23166

SCDJ035.ZIP (97 KB) - HSpice Model
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模擬型號

TS5A23166 IBIS Model

SCDM100.ZIP (94 KB) - IBIS Model
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封裝 引腳 下載
DSBGA (YZP) 8 檢視選項
DSBGA (YZT) 8 檢視選項
VSSOP (DCU) 8 檢視選項
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