TSM24B
- Robust surge protection:
- IEC61000-4-5 (8/20 µs): 20 A
- Low clamping voltage of 33 V (typical) at 20 A for 8/20 µs surge current protects downstream components
- Unidirectional polarity for optimized clamping performance on single ended data lines and power rails
- 24 V working voltage for protecting signals on 12 V systems
- Low leakage current of 75 nA (maximum)
- Low I/O capacitance of 24 pF (typical)
- Integrated IEC 61000-4-2 ESD protection
- ±30-kV contact discharge
- ±30-kV air-gap discharge
- Small SOT-23 leaded package to minimize board space and allow for automatic optical inspection (AOI)
The TSM24B is a part of TI’s surge protection device family. The TSM24B robustly shunts up to 20 A of IEC 61000-4-5 fault current to protect systems from high power transients or lightning strikes. The TSM24B is rated to dissipate ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±30-kV contact, ±30-kV air-gap). The TSM24B clamps during a surge event, keeping system exposure below 33 V (typical) at I PP = 20 A.
Additionally, the TSM24B is available in a small leaded SOT-23 (DBZ) package, which is reduced in size by approximately 50 percent compared to the industry standard SMA package. The device is designed to have a minimal effect on the protected line due to extremely low device leakage.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TSM24B Unidirectional Surge Protection Device in SOT-23 datasheet (Rev. A) | PDF | HTML | 2023年 10月 27日 |
設計與開發
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ESDEVM — ESD 評估模組
<p>靜電敏感裝置 (ESD) 評估模組 (EVM) 是我們大多數 ESD 產品組合的開發平台。此電路板配備所有傳統 ESD 元件封裝，可測試任意數量的裝置。裝置可以焊接到其相應的元件封裝上，然後進行測試。</p>
<p>對於一般高速 ESD 二極體，會實作阻抗控制的配置以取得 S 參數並取消內嵌電路板軌跡。對於非高速 ESD 二極體，其元件封裝會包含連接至測試點的軌跡，讓您輕鬆執行 DC 測試，例如崩潰電壓、保持電壓、洩漏等。電路板配置也可以透過將訊號針腳短路到訊號所在的任何地方，讓任何裝置針腳都能輕鬆地連接到電源 (V<sub>CC</sub>) 或接地。</p>
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 引腳 | 下載 |
|---|---|---|
| SOT-23 (DBZ) | 3 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點