TXS0206
- Level Translator
- VCCA and VCCB Range of 1.1 V to 3.6 V
- Fast Propagation Delay (4 ns Max When Translating
Between 1.8 V and 3 V)
- Integrated EMI Filtering and ESD Protection Circuitry
- ESD Protection Exceeds JESD 22 (A Port)
- 2500-V Human-Body Model (A114-B)
- 250-V Machine Model (A115-A)
- 1500-V Charged-Device Model (C101)
- ±8-kV Contact Discharge IEC 61000-4-2 ESD (B-port)
All other trademarks are the property of their respective owners.
The TXS0206 is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It includes a high-speed level translator along with ESD protection and EMI filtering circuitry.
The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206 enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.
Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206 incorporates ±8-kV Contact Discharge protection on the card side.
The TXS0206 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206 an ideal choice for these applications.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TXS0206 MMC, SD Card, Memory Stick(TM) Voltage-Translation Transceiver datasheet (Rev. C) | 2010年 1月 6日 | |
| Selection guide | Voltage Translation Buying Guide (Rev. A) | 2021年 4月 15日 | ||
| Application note | Translate Voltages for SDIO | PDF | HTML | 2020年 10月 20日 | |
| More literature | Voltage-Level Translation Guide (Rev. H) | 2015年 8月 31日 |
設計與開發
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訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點