UC1611-SP
- Matched, Four-Diode Monolithic Array
- High Peak Current
- Low-Cost MINIDIP Package
- Low-Forward Voltage
- Parallelable for Lower VF or Higher IF
- Fast Recovery Time
- Military Temperature Range Available
This four-diode array is designed for general purpose use as individual diodes or as a high-speed, high-current bridge. It is particularly useful on the outputs of high-speed power MOSFET drivers where Schottky diodes are needed to clamp any negative excursions caused by ringing on the driven line.These diodes are also ideally suited for use as voltage clamps when driving inductive loads such as relays and solenoids, and to provide a path for current free-wheeling in motor drive applications.The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.This single monolithic chip is fabricated in both hermetic CERDIP and copper-eaded plastic packages. The UC1611 in ceramic is designed for -55°C to 125°C environments but with reduced peak current capability: while the UC3611 in plastic has higher current rating over a 0°C to 70°C ambient temperature range.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | Quad Schottky Diode Array datasheet (Rev. A) | 2001年 5月 15日 | |
| * | SMD | UC1611-SP SMD 5962-90538 | 2016年 7月 8日 | |
| More literature | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) | 2023年 8月 31日 | ||
| Application note | Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) | PDF | HTML | 2022年 11月 17日 | |
| Application note | Single-Event Effects Confidence Interval Calculations (Rev. A) | PDF | HTML | 2022年 10月 19日 | |
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 | |
| Selection guide | TI Space Products (Rev. I) | 2022年 3月 3日 | ||
| User guide | Generic ESD Evaluation Module User's Guide (Rev. A) | PDF | HTML | 2021年 9月 27日 | |
| Application note | DLA Standard Microcircuit Drawings (SMD) and JAN Part Numbers Primer | 2020年 8月 21日 | ||
| Application note | Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and Form | PDF | HTML | 2020年 5月 18日 | |
| E-book | Radiation Handbook for Electronics (Rev. A) | 2019年 5月 21日 |
設計與開發
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|---|---|---|
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