Telecom Base Band Unit

System Block Diagram (SBD) for a Telecom Base Band unit featuring TI's Wireless SoC processor with Clocking and Interface Solution.

Block Diagram

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AC/DC Module DC/DC Module Remote Radio Unit

Reference Designs


Today's wireless base stations for the cellular telecommunications network must feature powerful signal processing capabilities in order to handle the large and growing amount of voice and data traffic on the network, and to support the multiple cellular technologies that are now prevalent.

The block diagram shown represents a contemporary, albeit generic, multimode base station capable of supporting all of today's cellular technologies, including WCDMA, LTE, WiMAX, CDMA2K, GSM/EDGE, UMTS, TD-SCDMA and others. Based on an advanced multicore system-on-a-chip (SoC) DSP for the base band processor, this architecture supports today's most sophisticated capabilities such as multiple in/multiple out (MIMO) antenna arrays, software defined radios (SDR), advanced receivers and leading-edge analog functionality with regards to signal filtering, power management and supervision, and other functions.

TI’s multicore SoC DSP delivers cutting edge fixed/floating point performance. It can perform Layer 1 PHY, Layer 2 MAC and transport layer processing, eliminating the need for an independent network processor. The device can integrate multiple lanes of OBSAI/CPRI antenna interface (full duplex) at high speed. The multiple high-performance embedded coprocessors on the chip can easily perform intense signal processing functions that are commonly found on wireless base stations in addition to significantly accelerating channel encoding/decoding operations. The extensive on-chip memory minimizes latency and increasing system performance. The Baseband Processor features SmartReflex™ class 3 capabilities which used in conjunction with a digital voltage controller ensures the industry's lowest power/performance ratio.

TI Clocking solutions provide high performance differential or single-ended clocks with less than 1 ps rms jitter from a low cost crystal/oscillator. Other features such as high degree of configurability via a SPI interface, programmable outputs and a loop filter are tailored for high speed data signal operations.

TI meets complete connectivity needs including LVDS, M-LVDS, RS232, RS485, SerDes and I2C. LVDS and M-LVDS transceivers have high signaling rate (up to 4.0 Gbps) and low skew making them excellent choices for signal distribution and data buffering. RS-232 and RS-485 transceivers offer high speed connections up to several kilometers at low power and are available with ESD protection up to 30 kV.

TI power management IC solutions provide optimized power to the Base Band Unit. AC/DC and DC/DC power supply modules have high level of integration with multiple outputs, various levels of fault protection, remote sense and small packaging. The Integrated Hot Swap Power Controllers are optimized for nominal 12V systems. The devices provide load current slew rate control and peak magnitude limiting. Most of the Hot Swap Controllers have digital interface for precise programming and monitoring and also have Power good and fault outputs. High efficiency LDOs and Switching regulators supply high output current at 12V and 3.3V. Their various features such as reverse voltage protection, high accuracy and low power dissipation make the design simple, small and robust.

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Application Notes (7)

Title Abstract Type Size (KB) Date Views
HTM 8 KB 22 Jul 2010 231
HTM 8 KB 05 Sep 2008 153
HTM 8 KB 08 May 2008 221
HTM 8 KB 09 Jan 2008 73
HTM 8 KB 11 Feb 2002 213
HTM 9 KB 16 Apr 2001 461
HTM 9 KB 04 Oct 2000 3891

Selection and Solution Guides

Selection Guides (2)

Title Abstract Type Size (KB) Date Views
PDF 9.45 MB 16 Apr 2015 76542
PDF 794 KB 27 Oct 2010 561

Product Bulletin & White Papers

Product Bulletin (3)

Title Abstract Type Size (MB) Date Views
PDF 208 KB 25 Apr 2011 703
PDF 735 KB 11 Feb 2011 349
PDF 291 KB 09 Nov 2010 99

White Papers (12)

Title Abstract Type Size (MB) Date Views
PDF 914 KB 23 Feb 2012 342
PDF 1.09 MB 23 Feb 2012 102
PDF 391 KB 23 Feb 2012 79
PDF 1014 KB 17 May 2011 602
PDF 552 KB 25 Apr 2011 211
PDF 993 KB 11 Feb 2011 143
PDF 1.33 MB 11 Feb 2011 170
PDF 562 KB 21 Dec 2010 441
PDF 423 KB 09 Nov 2010 933
PDF 3.55 MB 09 Nov 2010 395
HTM 9 KB 15 Feb 2010 203
HTM 9 KB 15 Feb 2010 153

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