SBAS533E
March 2011 – February 2023
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Description (continued)
6
Pin Configuration and Functions
Pin Functions – LVDS Mode
Pin Functions – CMOS Mode
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics: ADS4246, ADS4245, ADS4242
7.6
Electrical Characteristics: ADS4226, ADS4225, ADS4222
7.7
Electrical Characteristics: General
7.8
Digital Characteristics
7.9
Timing Requirements: LVDS and CMOS Modes (1)
7.10
Serial Interface Timing Characteristics (1)
7.11
Reset Timing (Only When Serial Interface Is Used)
7.12
Typical Characteristics
7.12.1
ADS4246
7.12.2
ADS4245
7.12.3
ADS4242
7.12.4
ADS4226
7.12.5
ADS4225
7.12.6
ADS4222
7.12.7
General
7.12.8
Contour
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagrams
8.3
Feature Description
8.3.1
Analog Input
8.3.1.1
Drive Circuit Requirements
8.3.1.2
Driving Circuit
8.3.2
Clock Input
8.3.3
Digital Functions
8.3.4
Gain for SFDR/SNR Trade-off
8.3.5
Offset Correction
8.4
Device Functional Modes
8.4.1
Power-Down
8.4.1.1
Global Power-Down
8.4.1.2
Channel Standby
8.4.1.3
Input Clock Stop
8.5
Programming
8.5.1
47
8.5.2
Parallel Configuration Only
8.5.3
Serial Interface Configuration Only
8.5.4
Using Both Serial Interface and Parallel Controls
8.5.5
Parallel Configuration Details
8.5.6
Serial Interface Details
8.5.6.1
Register Initialization
8.5.6.2
Serial Register Readout
8.5.7
Digital Output Information
8.5.7.1
Output Interface
8.5.7.2
DDR LVDS Outputs
8.5.7.3
LVDS Buffer
8.5.7.4
Parallel CMOS Interface
8.5.7.5
CMOS Interface Power Dissipation
8.5.7.6
Multiplexed Mode of Operation
8.5.7.7
Output Data Format
8.6
Register Maps
8.6.1
64
8.6.2
Description Of Serial Registers
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Analog Input
9.2.2.2
Clock Driver
9.2.2.3
Digital Interface
9.2.2.4
SNR and Clock Jitter
9.2.3
Application Curves
9.3
Power Supply Recommendations
9.3.1
Sharing DRVDD and AVDD Supplies
9.3.2
Using DC/DC Power Supplies
9.3.3
Power Supply Bypassing
9.4
Layout
9.4.1
Layout Guidelines
9.4.1.1
Grounding
9.4.1.2
Supply Decoupling
9.4.1.3
Exposed Pad
9.4.1.4
Routing Analog Inputs
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Device Support
10.1.1
Device Nomenclature
10.2
Documentation Support
10.2.1
Related Documentation
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGC|64
MPQF125F
Thermal pad, mechanical data (Package|Pins)
RGC|64
QFND123N
Orderable Information
sbas533e_oa
sbas533e_pm
1
Features
Ultralow power with single 1.8-V Supply, CMOS output:
183 mW Total power at 65 MSPS
277 mW Total power at 125 MSPS
332 mW Total power at 160 MSPS
High dynamic performance:
88-dBc SFDR at 170 MHz
71.4-dBFS SNR at 170 MHz
Crosstalk: > 90 dB at 185 MHz
Programmable gain up to 6 dB for SNR/SFDR trade-off
DC offset correction
Output interface options:
1.8-V parallel CMOS interface
Double data rate (DDR) LVDS with programmable swing:
Standard swing: 350 mV
Low swing: 200 mV
Supports low input clock amplitude down to
200 mV
PP
Package: VQFN-64 (9.00 mm × 9.00 mm)