SBAS729C June   2016  – August 2026 ADS8920B , ADS8922B , ADS8924B

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 LDO Module
      2. 6.3.2 Reference Buffer Module
      3. 6.3.3 Converter Module
        1. 6.3.3.1 Sample-and-Hold Circuit
        2. 6.3.3.2 Internal Oscillator
        3. 6.3.3.3 ADC Transfer Function
      4. 6.3.4 Interface Module
    4. 6.4 Device Functional Modes
      1. 6.4.1 RST State
      2. 6.4.2 ACQ State
      3. 6.4.3 CNV State
    5. 6.5 Programming
      1. 6.5.1 Output Data Word
      2. 6.5.2 Data Transfer Frame
      3. 6.5.3 Interleaving Conversion Cycles and Data Transfer Frames
      4. 6.5.4 Data Transfer Protocols
        1. 6.5.4.1 Protocols for Configuring the Device
        2. 6.5.4.2 Protocols for Reading From the Device
          1. 6.5.4.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols
          2. 6.5.4.2.2 SPI-Compatible Protocols with Bus Width Options
          3. 6.5.4.2.3 Source-Synchronous (SRC) Protocols
            1. 6.5.4.2.3.1 Output Clock Source Options with SRC Protocols
            2. 6.5.4.2.3.2 Bus Width Options With SRC Protocols
            3. 6.5.4.2.3.3 Output Data Rate Options With SRC Protocols
      5. 6.5.5 Device Setup
        1. 6.5.5.1 Single Device: All multiSPI Options
        2. 6.5.5.2 Single Device: Minimum Pins for a Standard SPI
        3. 6.5.5.3 Multiple Devices: Daisy-Chain Topology
        4. 6.5.5.4 Multiple Devices: Star Topology
  8. Register Maps
    1. 7.1 Device Configuration and Register Maps
      1. 7.1.1 PD_CNTL Register (address = 04h) [reset = 08h]
      2. 7.1.2 SDI_CNTL Register (address = 008h) [reset = 00h]
      3. 7.1.3 SDO_CNTL Register (address = 0Ch) [reset = 00h]
      4. 7.1.4 DATA_CNTL Register (address = 010h) [reset = 00h]
      5. 7.1.5 PATN_LSB Register (address = 014h) [reset = 00h]
      6. 7.1.6 PATN_MID Register (address = 015h) [reset = 00h]
      7. 7.1.7 PATN_MSB Register (address = 016h) [reset = 00h]
      8. 7.1.8 OFST_CAL Register (address = 020h) [reset = 00h]
      9. 7.1.9 REF_MRG Register (address = 030h) [reset = 00h]
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Reference Driver
      2. 8.1.2 ADC Input Driver
        1. 8.1.2.1 Charge-Kickback Filter
        2. 8.1.2.2 Input Amplifier Selection
    2. 8.2 Typical Application
      1. 8.2.1 Data Acquisition (DAQ) Circuit for Lowest Distortion and Noise Performance With Differential Input
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DAQ Circuit With FDA Input Driver and Single-Ended or Differential Input
      3. 8.2.3 Design Requirements
      4. 8.2.4 Detailed Design Procedure
      5. 8.2.5 Application Curves
    3. 8.3 Power-Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Signal Path
        2. 8.4.1.2 Grounding and PCB Stack-Up
        3. 8.4.1.3 Decoupling of Power Supplies
        4. 8.4.1.4 Reference Decoupling
        5. 8.4.1.5 Differential Input Decoupling
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Charge-Kickback Filter

The charge-kickback filter is an RC filter at the input pins of the ADC that filters the broadband noise from the front-end drive circuitry, and attenuates the sampling charge injection from the switched-capacitor input stage of the ADC. A filter capacitor, CFLT, is connected from each input pin of the ADC to the ground (as shown in Figure 8-1). This capacitor helps reduce the sampling charge injection and provides a charge bucket to quickly charge the internal sample-and-hold capacitors during the acquisition process. Generally, the value of this capacitor must be at least 20 times the specified value of the ADC sampling capacitance. For the ADS892xB, the input sampling capacitance is equal to 60pF; therefore, for optimal performance, keep CFLT greater than 1.2nF. This capacitor must be a COG- or NPO-type. The type of dielectric used in COG or NPO ceramic capacitors provides the most stable electrical properties over voltage, frequency, and temperature changes.

ADS8920B ADS8922B ADS8924B Charge
                    Kickback Filter Configuration Figure 8-1 Charge Kickback Filter Configuration

Driving capacitive loads can degrade the phase margin of the input amplifier, thus making the amplifier marginally unstable. To avoid amplifier stability issues, series isolation resistors (RFLT) are used at the output of the amplifiers. A higher value of RFLT helps with amplifier stability, but adds distortion as a result of interactions with the nonlinear input impedance of the ADC. Distortion increases with source impedance, input signal frequency, and input signal amplitude. Therefore, the selection of RFLT requires balancing the stability of the driver amplifier and distortion performance of the design. Always verify the stability and settling behavior of the driving amplifier and charge-kickback filter by TINA-TI™ SPICE simulation. Keep the tolerance of the selected resistors less than 1% to keep the inputs balanced.