SBAS729C June   2016  – August 2026 ADS8920B , ADS8922B , ADS8924B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 LDO Module
      2. 6.3.2 Reference Buffer Module
      3. 6.3.3 Converter Module
        1. 6.3.3.1 Sample-and-Hold Circuit
        2. 6.3.3.2 Internal Oscillator
        3. 6.3.3.3 ADC Transfer Function
      4. 6.3.4 Interface Module
    4. 6.4 Device Functional Modes
      1. 6.4.1 RST State
      2. 6.4.2 ACQ State
      3. 6.4.3 CNV State
    5. 6.5 Programming
      1. 6.5.1 Output Data Word
      2. 6.5.2 Data Transfer Frame
      3. 6.5.3 Interleaving Conversion Cycles and Data Transfer Frames
      4. 6.5.4 Data Transfer Protocols
        1. 6.5.4.1 Protocols for Configuring the Device
        2. 6.5.4.2 Protocols for Reading From the Device
          1. 6.5.4.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols
          2. 6.5.4.2.2 SPI-Compatible Protocols with Bus Width Options
          3. 6.5.4.2.3 Source-Synchronous (SRC) Protocols
            1. 6.5.4.2.3.1 Output Clock Source Options with SRC Protocols
            2. 6.5.4.2.3.2 Bus Width Options With SRC Protocols
            3. 6.5.4.2.3.3 Output Data Rate Options With SRC Protocols
      5. 6.5.5 Device Setup
        1. 6.5.5.1 Single Device: All multiSPI Options
        2. 6.5.5.2 Single Device: Minimum Pins for a Standard SPI
        3. 6.5.5.3 Multiple Devices: Daisy-Chain Topology
        4. 6.5.5.4 Multiple Devices: Star Topology
  8. 7 Register Maps
    1. 7.1 Device Configuration and Register Maps
      1. 7.1.1 PD_CNTL Register (address = 04h) [reset = 08h]
      2. 7.1.2 SDI_CNTL Register (address = 008h) [reset = 00h]
      3. 7.1.3 SDO_CNTL Register (address = 0Ch) [reset = 00h]
      4. 7.1.4 DATA_CNTL Register (address = 010h) [reset = 00h]
      5. 7.1.5 PATN_LSB Register (address = 014h) [reset = 00h]
      6. 7.1.6 PATN_MID Register (address = 015h) [reset = 00h]
      7. 7.1.7 PATN_MSB Register (address = 016h) [reset = 00h]
      8. 7.1.8 OFST_CAL Register (address = 020h) [reset = 00h]
      9. 7.1.9 REF_MRG Register (address = 030h) [reset = 00h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Reference Driver
      2. 8.1.2 ADC Input Driver
        1. 8.1.2.1 Charge-Kickback Filter
        2. 8.1.2.2 Input Amplifier Selection
    2. 8.2 Typical Application
      1. 8.2.1 Data Acquisition (DAQ) Circuit for Lowest Distortion and Noise Performance With Differential Input
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DAQ Circuit With FDA Input Driver and Single-Ended or Differential Input
      3. 8.2.3 Design Requirements
      4. 8.2.4 Detailed Design Procedure
      5. 8.2.5 Application Curves
    3. 8.3 Power-Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Signal Path
        2. 8.4.1.2 Grounding and PCB Stack-Up
        3. 8.4.1.3 Decoupling of Power Supplies
        4. 8.4.1.4 Reference Decoupling
        5. 8.4.1.5 Differential Input Decoupling
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

10 Revision History

Changes from Revision B (August 2017) to Revision C (August 2026)

  • Deleted first page table and added Package Information tableGo
  • Added serial clock frequency condition in Timing Characteristics table Go
  • Changed reset value of PD_CNTL to 08h.Go

Changes from Revision A (July 2016) to Revision B (August 2017)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Changed Device Information table into SPI Clock at 1MSPS table Go
  • Changed front-page diagramGo
  • Changed REFBUFOUT pin description from "Reference buffer output, ADC reference input" to "Internal reference buffer output, external reference input"Go
  • Changed DVDD range in condition line of Electrical Characteristics from 2.35V to 3.6V to 1.65V to 5.5VGo
  • Changed maximum value for DVDD range in Electrical Characteristics, Timing Requirements, and Switching Characteristics from 3.6V to 5.5VGo
  • Added TA = 25°C to reference buffer offset voltage test condition in Electrical Characteristics tableGo
  • Changed input offset thermal drift typ value from 10 to 1Go
  • Added fIN = 2kHz test condition to SFDR in Electrical Characteristics table Go
  • Added new conditions to serial clock frequency in the Timing Requirements tableGo
  • Changed serial clock time period in Timing Characteristics table Go
  • Added serial clock frequency conditions in Timing Characteristics table Go
  • Changed serial clock time period in Timing Characteristics table Go
  • Added strobe output time to Switching Characteristics tableGo
  • Added descriptive text and one figure to the Reference Buffer Module sectionGo
  • Deleted text from first note element regarding data transfer activity in zone 2Go
  • Added new option bullet for multiSPI digital interface module in Data Transfer Protocols section Go
  • Added new note (1) for SCLK in Table 9 Go
  • Deleted "For the ADS892xB, limit the value of RFLT to a maximum of 2.5Ω to avoid any significant degradation in linearity performance. " from the last paragraph of the Charge Kickback Filter sectionGo
  • Changed Data Acquisition (DAQ) Circuit for Lowest Distortion and Noise Performance... section for clarityGo
  • Added more design parameters to Design Parameters tableGo
  • Changed Detailed Design Procedure section for clarityGo
  • Added two new application curvesGo
  • Added new typical application subsection Go

Changes from Revision * (June 2016) to Revision A (July 2016)

  • Changed from product preview to production data Go
  • Changed DVDD specified throughput value in the Recommended Operating Conditions from 3.6V to 5.5VGo