SBAS630D October 2013 – May 2016 AFE1256
PRODUCTION DATA.
- 1Features
- 2Application
- 3Description
- 4Revision History
- 5Device and Documentation Support
- 6Mechanical, Packaging, and Orderable Information
Package Options
Refer to the PDF data sheet for device specific package drawings
Mechanical Data (Package|Pins)
- TDS|314
- TD|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
6.1 Tray Dimensions
Tray dimensions for the TDS package is shown in Figure 1.
Figure 1. TDS Tray Dimensions
6.2 GBTD Die
Figure 2 does not take into account the scribe seal.
Figure 2. GBTD Die Mechanical Data
Figure 3 provides the tray dimensions for the GBTD die.
Figure 3. GBTD Die Tray Dimension Details
Dies are placed active side up (bumps up) into waffle pack. The waffle pack notch is at the upper right, as shown in Figure 4.
Figure 4. GBTD Die, Pin 1 Location