Product details


Number of input channels 256 Resolution (Bits) 16 Features Internal Reference Buffer, Nap Mode, Power Down, X-ray Interface type SPI open-in-new Find other Digital X-ray AFEs


  • 256 Channels
  • On-Chip, 16-Bit ADC
  • Photodiode Short Immunity
  • Column Short Immunity
  • High Performance:
    • Noise: 758 e-RMS with 28-pF Sensor
      Capacitor in 1.2-pC Range
    • Integral Nonlinearity:
      ±2 LSB with Internal 16-Bit ADC
    • Minimum Scan Time:
      • 37.9 µs in Normal Mode
      • 20 µs in 2x Binning Mode
  • Integration:
    • Eight Selectable Full-Scale Ranges:
      0.15 pC (Min) to 9.6 pC (Max)
    • Built-In Correlated Double Sampler
    • 2x Binning (Averages Charge of Two Adjacent
      Channels) for Faster Throughput
    • Pipelined Integrate and Read: Allows Data
      Read During Integration
  • Flexibility:
    • Electron and Hole Integration
  • Low Power:
    • 2.9 mW/Ch with ADC
    • 2.3 mW/Ch without ADC
    • 0.1 mW/Ch in Nap Mode
    • Total Power-Down Feature
  • 22-mm × 5-mm Gold-Bump Die,
    Suitable for TCP and COF


  • Flat-Panel, X-Ray Detector

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open-in-new Find other Digital X-ray AFEs


The AFE1256 is a 256-channel, analog front-end (AFE) designed to suit the requirements of flat-panel detectors (FPDs) based on digital X-ray systems. The device includes 256 integrators, a programmable gain amplifier (PGA) for full-scale, charge-level selection, a correlated double sampler (CDS) with dual banking, 256:4 analog multiplexers, and four 16-bit, successive-approximation register (SAR) analog-to-digital converters (ADCs) onboard. Serial data from the ADCs are available in SPI™ format.

Hardware-selectable integration polarity allows for the integration of positive or negative charge and provides more flexibility in system design. The Nap feature enables substantial power saving. This power savings is especially useful in battery-powered systems.

The device is available as a 22-mm × 5-mm gold-bumped die and a 38-mm × 28-mm, COF-314 TDS package in singulated forms.

To request a full data sheet or other design resources: request AFE1256

open-in-new Find other Digital X-ray AFEs

More Information

Full data sheet and other design resources are available under NDA. Request now

Technical documentation

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Type Title Date
* Data sheet AFE1256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors datasheet (Rev. D) May 26, 2016
Technical article Offset correction improves the next generation of heart-rate smart watches Aug. 24, 2015
Technical article A new way to illuminate the human condition Dec. 30, 2013
Technical article Oximeter signaling: There’s more than meets the eye Dec. 04, 2013
Technical article Virtual hospital implementation using a worn health monitor Nov. 13, 2013
User guide AFE1256COF EVM Introduction User Guide Nov. 05, 2013

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

document-generic User guide

The AFE1256EVM is a compact USB based evaluation kit for evaluating the AFE1256 COF, a 256-channel analog front-end. The EVM is self-contained with DACs and on board pattern generator built , greatly reducing its dependency on external equipment so all it needs is a power supply. The kit consists of (...)

  • Characterizes the AFE1256 COF (externally detachable)
  • On-board analog signal generation
  • On board 3.4V DUT power generation
  • On board FPGA based pattern generation and data acquisition
  • Communicates with Personal Computer through a USB 2.0 interface

Design tools & simulation

PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)

CAD/CAE symbols

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(TDS) 314 View options

Ordering & quality

Information included:
  • RoHS
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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