SLOS738E September   2012  – August 2015 AFE5809

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Digital Demodulator Electrical Characteristics
    7. 7.7  Digital Characteristics
    8. 7.8  Switching Characteristics
    9. 7.9  SPI Switching Characteristics
    10. 7.10 Output Interface Timing Requirements (14-bit)
    11. 7.11 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LNA
      2. 8.3.2 Voltage-Controlled Attenuator
      3. 8.3.3 PGA
      4. 8.3.4 ADC
      5. 8.3.5 Continuous-Wave (CW) Beamformer
        1. 8.3.5.1 16 × ƒcw Mode
        2. 8.3.5.2 8 × ƒcw and 4 × ƒcw Modes
        3. 8.3.5.3 1 × ƒcw Mode
      6. 8.3.6 Digital I/Q Demodulator
      7. 8.3.7 Equivalent Circuits
      8. 8.3.8 LVDS Output Interface Description
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Peripheral Interface (SPI) Operation
        1. 8.5.1.1 ADC/VCA Serial Register Write Description
        2. 8.5.1.2 ADC/VCA Serial Register Readout Description
        3. 8.5.1.3 Digital Demodulator SPI Description
    6. 8.6 Register Maps
      1. 8.6.1 ADC and VCA Register Description
        1. 8.6.1.1 ADC Register Map
        2. 8.6.1.2 AFE5809 ADC Register/Digital Processing Description
          1. 8.6.1.2.1  AVERAGING_ENABLE: Address: 2[11]
          2. 8.6.1.2.2  ADC_OUTPUT_FORMAT: Address: 4[3]
          3. 8.6.1.2.3  ADC Reference Mode: Address 1[13] and 3[15]
          4. 8.6.1.2.4  DIGITAL_GAIN_ENABLE: Address: 3[12]
          5. 8.6.1.2.5  DIGITAL_HPF_ENABLE
          6. 8.6.1.2.6  DIGITAL_HPF_FILTER_K_CHX
          7. 8.6.1.2.7  LOW_FREQUENCY_NOISE_SUPPRESSION: Address: 1[11]
          8. 8.6.1.2.8  LVDS_OUTPUT_RATE_2X: Address: 1[14]
          9. 8.6.1.2.9  CHANNEL_OFFSET_SUBSTRACTION_ENABLE: Address: 3[8]
          10. 8.6.1.2.10 SERIALIZED_DATA_RATE: Address: 3[14:13]
          11. 8.6.1.2.11 TEST_PATTERN_MODES: Address: 2[15:13]
          12. 8.6.1.2.12 SYNC_PATTERN: Address: 10[8]
        3. 8.6.1.3 VCA Register Map
        4. 8.6.1.4 VCA Register Description
          1. 8.6.1.4.1 LNA Input Impedances Configuration (Active Termination Programmability)
          2. 8.6.1.4.2 Programmable Gain for CW Summing Amplifier
          3. 8.6.1.4.3 Programmable Phase Delay for CW Mixer
      2. 8.6.2 Digital Demodulator Register Description
        1. 8.6.2.1 Profile RAM and Coefficient RAM
          1. 8.6.2.1.1 Programming the Profile RAM
          2. 8.6.2.1.2 Procedure for Configuring Next Profile Vector
          3. 8.6.2.1.3 Programming the Coefficient RAM
          4. 8.6.2.1.4 Filter Coefficent Test Mode
          5. 8.6.2.1.5 TX_SYNC and SYNC_WORD Timing
          6. 8.6.2.1.6 FIR Filter Delay versus TX_TRIG Timing
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 LNA Configuration
          1. 9.2.2.1.1 LNA Input Coupling and Decoupling
          2. 9.2.2.1.2 LNA Noise Contribution
          3. 9.2.2.1.3 Active Termination
          4. 9.2.2.1.4 LNA Gain Switch Response
        2. 9.2.2.2 Voltage-Controlled Attenuator
        3. 9.2.2.3 CW Operation
          1. 9.2.2.3.1 CW Summing Amplifier
          2. 9.2.2.3.2 CW Clock Selection
          3. 9.2.2.3.3 CW Supporting Circuits
        4. 9.2.2.4 Low Frequency Support
        5. 9.2.2.5 ADC Operation
          1. 9.2.2.5.1 ADC Clock Configurations
          2. 9.2.2.5.2 ADC Reference Circuit
      3. 9.2.3 Application Curves
    3. 9.3 System Example
      1. 9.3.1 ADC Debug
      2. 9.3.2 VCA Debug
    4. 9.4 Do's and Don'ts
      1. 9.4.1 Driving the Inputs (Analog or Digital) Beyond the Power-Supply Rails
      2. 9.4.2 Driving the Device Signal Input With an Excessively High Level Signal
      3. 9.4.3 Driving the VCNTL Signal With an Excessive Noise Source
      4. 9.4.4 Using a Clock Source With Excessive Jitter, an Excessively Long Input Clock Signal Trace, or Having Other Signals Coupled to the ADC or CW Clock Signal Trace
      5. 9.4.5 LVDS Routing Length Mismatch
      6. 9.4.6 Failure to Provide Adequate Heat Removal
  10. 10Power Supply Recommendations
    1. 10.1 Power/Performance Optimization
    2. 10.2 Power Management Priority
    3. 10.3 Partial Power-Up and Power-Down Mode
    4. 10.4 Complete Power-Down Mode
    5. 10.5 Power Saving in CW Mode
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • 8-Channel Complete Analog Front-End
    • LNA, VCAT, PGA, LPF, ADC, and CW Mixer
  • Programmable Gain Low-Noise Amplifier (LNA)
    • 24-, 18-, 12-dB Gain
    • 0.25-, 0.5-, 1-VPP Linear Input Range
    • 0.63-, 0.7-, 0.9-nV/rtHz Input Referred Noise
    • Programmable Active Termination
  • 40-dB Low-Noise Voltage Controlled Attenuator (VCAT)
  • 24-/30-dB Programmable Gain Amplifier (PGA)
  • Third-Order Linear Phase Low-Pass Filter (LPF)
    • 10, 15, 20, 30 MHz
  • 14-Bit Analog-to-Digital Converter (ADC)
    • 77 dBFS SNR at 65 MSPS
    • LVDS Outputs
  • Noise, Power Optimizations (Without Digital Demodulator)
    • 158 mW/CH at 0.75 nV/rtHz, 65 MSPS
    • 101 mW/CH at 1.1 nV/rtHz, 40 MSPS
    • 80 mW/CH at CW Mode
  • Excellent Device-to-Device Gain Matching
    • ±0.5 dB (Typical) and ±1 dB (Maximum)
  • Digital I/Q Demodulator after ADC
    • Wide Range Demodulation Frequency
    • <1 kHz Frequency Resolution
    • Decimation Filter Factor M = 1 to 32
    • 16xM Tap FIR Decimation Filter
    • LVDS Rate Reduction after Demodulation
    • On-Chip RAM With 32 Preset Profiles
  • Low Harmonic Distortion
  • Low-Frequency Sonar Signal Processing
  • Fast and Consistent Overload Recovery
  • Passive Mixer for Continuous Wave Doppler (CWD)
    • Low Close-in Phase Noise –156 dBc/Hz at 1 kHz off 2.5-MHz Carrier
    • Phase Resolution of 1/16λ
    • Support 16×, 8×, 4×, and 1× CW Clocks
    • 12-dB Suppression on Third and Fifth Harmonics
    • Flexible Input Clocks
  • Small Package: 15 mm × 9 mm, 135-BGA

2 Applications

  • Medical Ultrasound Imaging
  • Nondestructive Evaluation Equipments
  • Sonar Applications

3 Description

The AFE5809 device is a highly-integrated analog front-end (AFE) solution specifically designed for ultrasound systems in which high performance and small size are required. The AFE5809 device integrates a complete time-gain-control (TGC) imaging path and a CWD path. The device also enables users to select one of various power and noise combinations to optimize system performance. Therefore, the AFE5809 device is a suitable ultrasound AFE solution not only for high-end systems, but also for portable ones.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
AFE5809 NFBGA (135) 15.00 mm × 9.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Block Diagram

AFE5809 board_los738.gif