SLASF21 December   2022 AFE78101 , AFE88101

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements
    7. 6.7  Timing Diagrams
    8. 6.8  Typical Characteristics: VOUT DAC
    9. 6.9  Typical Characteristics: ADC
    10. 6.10 Typical Characteristics: Reference
    11. 6.11 Typical Characteristics: Power Supply
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter (DAC) Overview
        1. 7.3.1.1 DAC Resistor String
        2. 7.3.1.2 DAC Buffer Amplifier
        3. 7.3.1.3 DAC Transfer Function
        4. 7.3.1.4 DAC Gain and Offset Calibration
        5. 7.3.1.5 Programmable Slew Rate
        6. 7.3.1.6 DAC Register Structure and CLEAR State
      2. 7.3.2 Analog-to-Digital Converter (ADC) Overview
        1. 7.3.2.1 ADC Operation
        2. 7.3.2.2 ADC Custom Channel Sequencer
        3. 7.3.2.3 ADC Synchronization
        4. 7.3.2.4 ADC Offset Calibration
        5. 7.3.2.5 External Monitoring Inputs
        6. 7.3.2.6 Temperature Sensor
        7. 7.3.2.7 Self-Diagnostic Multiplexer
        8. 7.3.2.8 ADC Bypass
      3. 7.3.3 Programmable Out-of-Range Alarms
        1. 7.3.3.1 Alarm Action Configuration Register
        2. 7.3.3.2 Alarm Voltage Generator
        3. 7.3.3.3 Temperature Sensor Alarm Function
        4. 7.3.3.4 Internal Reference Alarm Function
        5. 7.3.3.5 ADC Alarm Function
        6. 7.3.3.6 Fault Detection
      4. 7.3.4 IRQ
      5. 7.3.5 Internal Reference
      6. 7.3.6 Integrated Precision Oscillator
      7. 7.3.7 One-Time Programmable (OTP) Memory
    4. 7.4 Device Functional Modes
      1. 7.4.1 DAC Power-Down Mode
      2. 7.4.2 Reset
    5. 7.5 Programming
      1. 7.5.1 Communication Setup
        1. 7.5.1.1 SPI Mode
        2. 7.5.1.2 UART Mode
      2. 7.5.2 Serial Peripheral Interface (SPI)
        1. 7.5.2.1 SPI Frame Definition
        2. 7.5.2.2 SPI Read and Write
        3. 7.5.2.3 Frame Error Checking
        4. 7.5.2.4 Synchronization
      3. 7.5.3 UART
        1. 7.5.3.1 UART Break Mode (UBM)
      4. 7.5.4 Status Bits
      5. 7.5.5 Watchdog Timer
    6. 7.6 Register Maps
      1. 7.6.1 AFEx8101 Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multichannel Configuration
    2. 8.2 Typical Application
      1. 8.2.1 4-mA to 20-mA Current Transmitter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Start-Up Circuit
          2. 8.2.1.2.2 Current Loop Control
          3. 8.2.1.2.3 Input Protection and Rectification
          4. 8.2.1.2.4 System Current Budget
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.3.2 Alarm Voltage Generator

Figure 7-12 shows that the alarm voltage is generated independently from the DAC output voltage. The alarm polarity control logic selects the output level of the alarm voltage generator. The alarm action control logic selects between the DAC output and alarm voltage generator output voltages. The alarm action control logic also controls the output buffer Hi-Z switch.

Figure 7-12 Alarm Voltage Generator Architecture

During normal operation, the expected VOUT voltage depends on the DAC_CODE. The ADC thresholds for the SD4 (VOUT) diagnostic channel are set around the programmed DAC_CODE. During the alarm condition, if the alarm action changes the VOUT voltage to the alarm voltage, or switches the VOUT buffer into Hi-Z mode, the VOUT voltage no longer depends on the DAC_CODE. In this case, the SD4 (VOUT) diagnostic channel also reports the alarm. To clear this alarm, as long as all other alarm conditions are cleared, set the alarm action to either no action or to the DAC clear code. Applying either alarm action sets the VOUT voltage within the expected ADC thresholds and clears the alarm after the next ADC measurement of the SD4 (VOUT) channel.

Give special consideration to the alarm logic during the transient events. When the new DAC_CODE goes beyond the SD4 (VOUT) alarm thresholds with the ADC monitoring the SD4 (VOUT) input in auto mode, the ADC conversion can occur while VOUT settles to a new value. This conversion can trigger a false alarm. There are two ways to prevent this false alarm:

  1. Use direct mode and allow VOUT to settle before triggering the next ADC conversion.
  2. Set ADC_CFG.FLT_CNT > 0. With this configuration, a single error in SD4 or any other measurement does not cause an alarm condition to be asserted.