SPRS695D September   2011  – January 2016 AM3871 , AM3874

PRODUCTION DATA.  

  1. 1High-Performance System-on-Chip (SoC)
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
    1. 2.1  Device Comparison
    2. 2.2  Device Characteristics
    3. 2.3  Device Compatibility
    4. 2.4  ARM Cortex-A8 Microprocessor Unit (MPU) Subsystem Overview
      1. 2.4.1 ARM Cortex-A8 RISC Processor
      2. 2.4.2 Embedded Trace Module (ETM)
      3. 2.4.3 ARM Cortex-A8 Interrupt Controller (AINTC)
      4. 2.4.4 ARM Cortex-A8 PLL (PLL_ARM)
      5. 2.4.5 ARM MPU Interconnect
    5. 2.5  Media Controller Overview
    6. 2.6  SGX530 Overview
    7. 2.7  Spinlock Module Overview
    8. 2.8  Mailbox Module Overview
    9. 2.9  Memory Map Summary
      1. 2.9.1 L3 Memory Map
      2. 2.9.2 L4 Memory Map
        1. 2.9.2.1 L4 Fast Peripheral Memory Map
        2. 2.9.2.2 L4 Slow Peripheral Memory Map
      3. 2.9.3 DDR DMM TILER Extended Addressing Map
    10. 2.10 Pin Maps
    11. 2.11 Terminal Functions
      1. 2.11.1  Boot Configuration
      2. 2.11.2  Camera Interface (I/F)
      3. 2.11.3  Controller Area Network (DCAN) Modules (DCAN0, DCAN1)
      4. 2.11.4  DDR2/DDR3 Memory Controller
      5. 2.11.5  EDMA
      6. 2.11.6  EMAC [(R)(G)MII Modes] and MDIO
      7. 2.11.7  General-Purpose Input/Outputs (GPIOs)
      8. 2.11.8  GPMC
      9. 2.11.9  HDMI
      10. 2.11.10 I2C
      11. 2.11.11 McASP
      12. 2.11.12 McBSP
      13. 2.11.13 PCI-Express (PCIe)
      14. 2.11.14 Reset, Interrupts, and JTAG Interface
      15. 2.11.15 Serial ATA (SATA) Signals
      16. 2.11.16 SD Signals (MMC/SD/SDIO)
      17. 2.11.17 SPI
      18. 2.11.18 Oscillator/PLL, Audio Reference Clocks, and Clock Generator
      19. 2.11.19 Timer
      20. 2.11.20 UART
      21. 2.11.21 USB
      22. 2.11.22 Video Input (Digital)
      23. 2.11.23 Video Output (Digital)
      24. 2.11.24 Video Output (Analog, TV)
      25. 2.11.25 Reserved Pins
      26. 2.11.26 Supply Voltages
      27. 2.11.27 Ground Pins (VSS)
  3. 3Device Configurations
    1. 3.1 Control Module Registers
    2. 3.2 Boot Modes
      1. 3.2.1 XIP (NOR) Boot Options
      2. 3.2.2 NAND Flash Boot
      3. 3.2.3 NAND I2C Boot (I2C EEPROM)
      4. 3.2.4 MMC/SD Cards Boot
      5. 3.2.5 SPI Boot
      6. 3.2.6 Ethernet PHY Mode Selection
      7. 3.2.7 PCIe Bootmode (PCIE_32 and PCIE_64)
      8. 3.2.8 UART Bootmode
    3. 3.3 Pin Multiplexing Control
    4. 3.4 Handling Unused Pins
    5. 3.5 DeBugging Considerations
      1. 3.5.1 Pullup/Pulldown Resistors
  4. 4 System Interconnect
  5. 5Device Operating Conditions
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Power-On Hours (POH)
    4. 5.4 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature (Unless Otherwise Noted)
    5. 5.5 Thermal Resistance Characteristics (PBGA Package) [CYE-04] (Thinner Top Hat)
  6. 6Power, Reset, Clocking, and Interrupts
    1. 6.1 Power, Reset and Clock Management (PRCM) Module
    2. 6.2 Power
      1. 6.2.1 Voltage and Power Domains
        1. 6.2.1.1 Core Logic Voltage Domains
        2. 6.2.1.2 Memory Voltage Domains
        3. 6.2.1.3 Power Domains
      2. 6.2.2 SmartReflex [Not Supported]
        1. 6.2.2.1 Dynamic Voltage Frequency Scaling (DVFS)
        2. 6.2.2.2 Adaptive Voltage Scaling [Not Supported]
      3. 6.2.3 Memory Power Management
      4. 6.2.4 SERDES_CLKP and SERDES_CLKN LDO
      5. 6.2.5 Dual Voltage I/Os
      6. 6.2.6 I/O Power-Down Modes
      7. 6.2.7 Standby Mode
      8. 6.2.8 Supply Sequencing
        1. 6.2.8.1 Power-Up Sequence
        2. 6.2.8.2 Power-Down Sequence
      9. 6.2.9 Power-Supply Decoupling
        1. 6.2.9.1 Analog and PLL
        2. 6.2.9.2 Digital
    3. 6.3 Reset
      1. 6.3.1  System-Level Reset Sources
      2. 6.3.2  Power-on Reset (POR pin)
      3. 6.3.3  External Warm Reset (RESET pin)
      4. 6.3.4  Emulation Warm Reset
      5. 6.3.5  Watchdog Reset
      6. 6.3.6  Software Global Cold Reset
      7. 6.3.7  Software Global Warm Reset
      8. 6.3.8  Test Reset (TRST pin)
      9. 6.3.9  Local Reset
      10. 6.3.10 Reset Priority
      11. 6.3.11 Reset Status Register
      12. 6.3.12 PCIE Reset Isolation
      13. 6.3.13 EMAC Switch Reset Isolation
      14. 6.3.14 RSTOUT_WD_OUT Pin
      15. 6.3.15 Effect of Reset on Emulation and Trace
      16. 6.3.16 Reset During Power Domain Switching
      17. 6.3.17 Pin Behaviors at Reset
      18. 6.3.18 Reset Electrical Data/Timing
    4. 6.4 Clocking
      1. 6.4.1  Device (DEV) and Auxiliary (AUX) Clock Inputs
        1. 6.4.1.1 Using the Internal Oscillators
        2. 6.4.1.2 Using a 1.8V LVCMOS-Compatible Clock Input
      2. 6.4.2  SERDES_CLKN/P Input Clock
      3. 6.4.3  AUD_CLKINx Input Clocks
      4. 6.4.4  CLKIN32 Input Clock
      5. 6.4.5  External Input Clocks
      6. 6.4.6  Output Clocks Select Logic
      7. 6.4.7  Input/Output Clocks Electrical Data/Timing
      8. 6.4.8  PLLs
        1. 6.4.8.1 PLL Power Supply Filtering
        2. 6.4.8.2 PLL Multipliers and Dividers
        3. 6.4.8.3 PLL Frequency Limits
        4. 6.4.8.4 PLL Register Descriptions
      9. 6.4.9  SYSCLKs
      10. 6.4.10 Module Clocks
    5. 6.5 Interrupts
      1. 6.5.1 ARM Cortex-A8 Interrupts
  7. 7 Peripheral Information and Timings
    1. 7.1  Parameter Information
      1. 7.1.1 1.8-V and 3.3-V Signal Transition Levels
      2. 7.1.2 3.3-V Signal Transition Rates
      3. 7.1.3 Timing Parameters and Board Routing Analysis
    2. 7.2  Recommended Clock and Control Signal Transition Behavior
    3. 7.3  Controller Area Network Interface (DCAN)
      1. 7.3.1 DCAN Peripheral Register Descriptions
      2. 7.3.2 DCAN Electrical Data/Timing
    4. 7.4  EDMA
      1. 7.4.1 EDMA Channel Synchronization Events
      2. 7.4.2 EDMA Peripheral Register Descriptions
    5. 7.5  Emulation Features and Capability
      1. 7.5.1 Advanced Event Triggering (AET)
      2. 7.5.2 Trace
      3. 7.5.3 IEEE 1149.1 JTAG
        1. 7.5.3.1 JTAG ID (JTAGID) Register Description
        2. 7.5.3.2 JTAG Electrical Data/Timing
    6. 7.6  Ethernet MAC Switch (EMAC SW)
      1. 7.6.1 EMAC Peripheral Register Descriptions
      2. 7.6.2 EMAC Electrical Data/Timing
        1. 7.6.2.1 EMAC MII and GMII Electrical Data/Timing
        2. 7.6.2.2 EMAC RMII Electrical Data/Timing
        3. 7.6.2.3 EMAC RGMII Electrical Data/Timing
      3. 7.6.3 Management Data Input/Output (MDIO)
        1. 7.6.3.1 MDIO Peripheral Register Descriptions
        2. 7.6.3.2 MDIO Electrical Data/Timing
    7. 7.7  General-Purpose Input/Output (GPIO)
      1. 7.7.1 GPIO Peripheral Register Descriptions
      2. 7.7.2 GPIO Electrical Data/Timing
    8. 7.8  General-Purpose Memory Controller (GPMC) and Error Location Module (ELM)
      1. 7.8.1 GPMC and ELM Peripherals Register Descriptions
      2. 7.8.2 GPMC Electrical Data/Timing
        1. 7.8.2.1 GPMC/NOR Flash Interface Synchronous Mode Timing (Nonmultiplexed and Multiplexed Modes)
        2. 7.8.2.2 GPMC/NOR Flash Interface Asynchronous Mode Timing (Nonmultiplexed and Multiplexed Modes)
        3. 7.8.2.3 GPMC/NAND Flash and ELM Interface Timing
    9. 7.9  High-Definition Multimedia Interface (HDMI)
      1. 7.9.1 HDMI Design Guidelines
        1. 7.9.1.1 HDMI Interface Schematic
        2. 7.9.1.2 TMDS Routing
        3. 7.9.1.3 DDC Signals
        4. 7.9.1.4 HDMI ESD Protection Device (Required)
        5. 7.9.1.5 PCB Stackup Specifications
        6. 7.9.1.6 Grounding
    10. 7.10 High-Definition Video Processing Subsystem (HDVPSS)
      1. 7.10.1 HDVPSS Electrical Data/Timing
      2. 7.10.2 Video DAC Guidelines and Electrical Data/Timing
    11. 7.11 Inter-Integrated Circuit (I2C)
      1. 7.11.1 I2C Peripheral Register Descriptions
      2. 7.11.2 I2C Electrical Data/Timing
    12. 7.12 Imaging Subsystem (ISS)
      1. 7.12.1 ISSCAM Electrical Data/Timing
    13. 7.13 DDR2/DDR3 Memory Controller
      1. 7.13.1 DDR2/3 Memory Controller Register Descriptions
      2. 7.13.2 DDR2/DDR3 PHY Register Descriptions
      3. 7.13.3 DDR-Related Control Module Registers Description
      4. 7.13.4 DDR2/DDR3 Memory Controller Electrical Data/Timing
        1. 7.13.4.1 DDR2 Routing Specifications
          1. 7.13.4.1.1 DDR2 Interface
            1. 7.13.4.1.1.1  DDR2 Interface Schematic
            2. 7.13.4.1.1.2  Compatible JEDEC DDR2 Devices
            3. 7.13.4.1.1.3  PCB Stackup
            4. 7.13.4.1.1.4  Placement
            5. 7.13.4.1.1.5  DDR2 Keepout Region
            6. 7.13.4.1.1.6  Bulk Bypass Capacitors
            7. 7.13.4.1.1.7  High-Speed Bypass Capacitors
            8. 7.13.4.1.1.8  Net Classes
            9. 7.13.4.1.1.9  DDR2 Signal Termination
            10. 7.13.4.1.1.10 VREFSSTL_DDR Routing
          2. 7.13.4.1.2 DDR2 CK and ADDR_CTRL Routing
        2. 7.13.4.2 DDR3 Routing Specifications
          1. 7.13.4.2.1 DDR3 versus DDR2
          2. 7.13.4.2.2 DDR3 EMIFs
          3. 7.13.4.2.3 DDR3 Device Combinations
          4. 7.13.4.2.4 DDR3 Interface Schematic
            1. 7.13.4.2.4.1  Compatible JEDEC DDR3 Devices
            2. 7.13.4.2.4.2  PCB Stackup
            3. 7.13.4.2.4.3  Placement
            4. 7.13.4.2.4.4  DDR3 Keepout Region
            5. 7.13.4.2.4.5  Bulk Bypass Capacitors
            6. 7.13.4.2.4.6  High-Speed Bypass Capacitors
              1. 7.13.4.2.4.6.1 Return Current Bypass Capacitors and Vias
            7. 7.13.4.2.4.7  Net Classes
            8. 7.13.4.2.4.8  DDR3 Signal Termination
            9. 7.13.4.2.4.9  VREFSSTL_DDR Routing
            10. 7.13.4.2.4.10 VTT
            11. 7.13.4.2.4.11 CK and ADDR_CTRL Topologies and Routing Definition
              1. 7.13.4.2.4.11.1 Four DDR3 Devices
                1. 7.13.4.2.4.11.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
                2. 7.13.4.2.4.11.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
              2. 7.13.4.2.4.11.2 Two DDR3 Devices
                1. 7.13.4.2.4.11.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
                2. 7.13.4.2.4.11.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
              3. 7.13.4.2.4.11.3 One DDR3 Device
                1. 7.13.4.2.4.11.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
                2. 7.13.4.2.4.11.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
            12. 7.13.4.2.4.12 Data Topologies and Routing Definition
              1. 7.13.4.2.4.12.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
              2. 7.13.4.2.4.12.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
            13. 7.13.4.2.4.13 Routing Specification
              1. 7.13.4.2.4.13.1 CK and ADDR_CTRL Routing Specification
              2. 7.13.4.2.4.13.2 DQS and DQ Routing Specification
    14. 7.14 Multichannel Audio Serial Port (McASP)
      1. 7.14.1 McASP Device-Specific Information
      2. 7.14.2 McASP0, McASP1, McASP2, McASP3, McASP4, and McASP5 Peripheral Registers Descriptions
      3. 7.14.3 McASP (McASP[5:0]) Electrical Data/Timing
    15. 7.15 Multichannel Buffered Serial Port (McBSP)
      1. 7.15.1 McBSP Peripheral Register Descriptions
      2. 7.15.2 McBSP Electrical Data/Timing
    16. 7.16 MultiMedia Card/Secure Digital/Secure Digital Input Output (MMC/SD/SDIO)
      1. 7.16.1 MMC/SD/SDIO Peripheral Register Descriptions
      2. 7.16.2 MMC/SD/SDIO Electrical Data/Timing
    17. 7.17 Peripheral Component Interconnect Express (PCIe)
      1. 7.17.1 PCIe Peripheral Register Descriptions
      2. 7.17.2 PCIe Electrical Data/Timing
      3. 7.17.3 PCIe Design and Layout Guidelines
        1. 7.17.3.1 Clock Source
        2. 7.17.3.2 PCIe Connections and Interface Compliance
          1. 7.17.3.2.1 Coupling Capacitors
          2. 7.17.3.2.2 Polarity Inversion
        3. 7.17.3.3 Nonstandard PCIe Connections
          1. 7.17.3.3.1 PCB Stackup Specifications
          2. 7.17.3.3.2 Routing Specifications
    18. 7.18 Serial ATA Controller (SATA)
      1. 7.18.1 SATA Peripheral Register Descriptions
      2. 7.18.2 SATA Interface Design Guidelines
        1. 7.18.2.1 SATA Interface Schematic
        2. 7.18.2.2 Compatible SATA Components and Modes
        3. 7.18.2.3 PCB Stackup Specifications
        4. 7.18.2.4 Routing Specifications
        5. 7.18.2.5 Coupling Capacitors
    19. 7.19 Serial Peripheral Interface (SPI)
      1. 7.19.1 SPI Peripheral Register Descriptions
      2. 7.19.2 SPI Electrical Data/Timing
    20. 7.20 Timers
      1. 7.20.1 Timer Peripheral Register Descriptions
      2. 7.20.2 Timer Electrical/Data Timing
    21. 7.21 Universal Asynchronous Receiver/Transmitter (UART)
      1. 7.21.1 UART Peripheral Register Descriptions
      2. 7.21.2 UART Electrical/Data Timing
    22. 7.22 Universal Serial Bus (USB2.0)
      1. 7.22.1 USB2.0 Peripheral Register Descriptions
      2. 7.22.2 USB2.0 Electrical Data/Timing
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device and Development-Support Tool Nomenclature
    2. 8.2 Documentation Support
    3. 8.3 Related Links
    4. 8.4 Community Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Export Control Notice
    8. 8.8 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • CYE|684
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Operating Conditions

5.1 Absolute Maximum Ratings (1)(2)

Supply voltage ranges (Steady State): Core (CVDD, CVDD_ARM) -0.3 V to 1.5 V
I/O, 1.8 V (DVDD_M, DVDD_DDR[0], DVDD_DDR[1], VDDA_1P8, VDDA_ARMPLL_1P8, VDDA_VID0PLL_1P8, VDDA_VID1PLL_1P8, VDDA_AUDIOPLL_1P8, VDDA_DDRPLL_1P8, VDDA_L3PLL_1P8, VDDA_PCIE_1P8, VDDA_SATA_1P8, VDDA_HDMI_1P8, VDDA_USB0_1P8, VDDA_USB1_1P8, VDDA_VDAC_1P8) -0.3 V to 2.1 V
I/O 3.3 V (DVDD, DVDD_GPMC, DVDD_GPMCB, DVDD_SD, DVDD_C) -0.3 V to 4.0 V
DDR Reference Voltage (VREFSSTL_DDR[0], VREFSSTL_DDR[1]) -0.3 V to 1.1 V
Input and Output voltage ranges: V I/O, 1.5-V pins (Steady State) -0.3 V to DVDD_DDR[x] + 0.3 V
V I/O, 1.8-V pins (Steady State) -0.3 V to DVDD + 0.3 V
-0.3 V to DVDD_x + 0.3 V
V I/O, 3.3-V pins (Steady State) -0.3 V to DVDD + 0.3 V
-0.3 V to DVDD_x + 0.3 V
Operating junction temperature range, TJ: Commercial Temperature 0°C to 90°C
Industrial -40°C to 90°C
Extended -40°C to 105°C
Storage temperature range, Tstg: -55°C to 150°C
Latch-up Performance: I-test: Silicon Revision 3.0, All I/O pins(5) ±100 mA
I-test: Silicon Revision 2.1, All I/O pins(5) ±70 mA
Over-Voltage Test, All Supply pins(6) 1.5xVddmax V
Electrostatic Discharge (ESD) Performance: ESD-HBM (Human Body Model)(3) ±1000 V
ESD-CDM (Charged-Device Model)(4) ±250 V
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to their associated VSS or VSSA_x.
(3) Level listed is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 500-V HBM is possible if necessary precautions are taken. Pins listed as 1000 V may actually have higher performance.
(4) Level listed is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 250-V CDM is possible if necessary precautions are taken. Pins listed as 250 V may actually have higher performance.
(5) Pins stressed per JEDEC JESD78 at 90°C (Class II) and passed with specified I/O pin injection current and clamp voltage of 1.5 times maximum recommended I/O voltage and negative 0.5 times maximum recommended I/O voltage.
(6) Supplies stressed per JEDEC JESD78 at 90°C (Class II) and passed specified voltage injection.

5.2 Recommended Operating Conditions

PARAMETER MIN NOM MAX UNIT
CVDD Supply voltage, Core (Scalable)
DVFS only, No AVS		 166% OPP 1.28 1.35 1.42 V
120% OPP 1.14 1.20 1.26
100% OPP 1.05 1.10 1.16
DVDD Supply voltage, I/O, standard pins(2) 3.3 V 3.14 3.3 3.47 V
1.8 V 1.71 1.8 1.89
DVDD_GPMC Supply voltage, I/O, GPMC pin group 3.3 V 3.14 3.3 3.47 V
1.8 V 1.71 1.8 1.89
DVDD_GPMCB Supply voltage, I/O, GPMCB pin group 3.3 V 3.14 3.3 3.47 V
1.8 V 1.71 1.8 1.89
DVDD_SD Supply voltage, I/O, SD pin group 3.3 V 3.14 3.3 3.47 V
1.8 V 1.71 1.8 1.89
DVDD_C Supply voltage, I/O, C pin group 3.3 V 3.14 3.3 3.47 V
1.8 V 1.71 1.8 1.89
DVDD_M Supply voltage, I/O, M pin group 1.8 V 1.71 1.8 1.89 V
DVDD_DDR[0]
DVDD_DDR[1]		 Supply voltage, I/O, DDR[0] and DDR[1] DDR2 1.71 1.8 1.89 V
DDR3 mode 1.43 1.5 1.58
VDDA_USB_3P3 Supply voltage, I/O, Analog, USB 3.3 V 3.14 3.3 3.47 V
VDDA_1P8
VDDA_x_1P8		 Supply Voltage, I/O, Analog, (VDDA_1P8, VDDA_ARMPLL_1P8, VDDA_VID0PLL_1P8, VDDA_VID1PLL_1P8, VDDA_AUDIOPLL_1P8, VDDA_DDRPLL_1P8, VDDA_L3PLL_1P8, VDDA_PCIE_1P8, VDDA_SATA_1P8, VDDA_HDMI_1P8, VDDA_USB0_1P8, VDDA_USB1_1P8, VDDA_VDAC_1P8)
Note: HDMI, USB0/1, and VDAC relative to their respective VSSA.		 1.71 1.8 1.89 V
VSS Supply Ground (VSS, VSSA_HDMI, VSSA_USB, VSSA_VDAC, VSSA_DEVOSC(1), VSSA_AUXOSC(1)) 0 V
VREFSSTL_DDR[x] IO Reference Voltage, (VREFSSTL_DDR[0], VREFSSTL_DDR[1]) 0.49 * DVDD_DDR[x] 0.50 * DVDD_DDR[x] 0.51 * DVDD_DDR[x] V
USBx_VBUSIN USBx VBUS Comparator Input 4.75 5 5.25 V
VIH High-level input voltage, LVCMOS (JTAG[TCK] pins), 3.3 V(2) 2 V
High-level input voltage, JTAG[TCK], 3.3 V 2.15 V
High-level input voltage, JTAG[TCK], 1.8 V 1.45 V
High-level input voltage, I2C (I2C[0] and I2C[1]) 0.7DVDD V
High-level input voltage, LVCMOS(2), 1.8 V 0.65DVDDx V
VIL Low-level input voltage, LVCMOS(2), 3.3 V 0.8 V
Low-level input voltage, JTAG[TCK] 0.45 V
Low-level input voltage, I2C (I2C[0] and I2C[1]) 0.3DVDDx V
Low-level input voltage, LVCMOS(2), 1.8 V 0.35DVDDx V
IOH High-level output current 6 mA I/O buffers -6 mA
DDR[0], DDR[1] buffers @ 50-Ω impedance setting -8 mA
IOL Low-level output current 6 mA I/O buffers 6 mA
DDR[0], DDR[1] buffers @ 50-Ω impedance setting 8 mA
VID Differential input voltage (SERDES_CLKN/P), [AC coupled] 0.250 2.0 V
tt Transition time, 10% - 90%, All inputs (unless otherwise specified in the Electrical Data/Timing sections of each peripheral) 0.25P or 10(3) ns
TJ Operating junction temperature range(4) Commercial Temperature (default) 0 90 °C
Industrial -40 90 °C
Extended -40 105 °C
(1) When using the internal Oscillators, the oscillator grounds (VSSA_DEVOSC, VSSA_AUXOSC) must be kept separate from other grounds and connected directly to the crystal load capacitor ground.
(2) LVCMOS pins are all I/O pins powered by DVDD, DVDD_GPMC, DVDD_GPMCB, DVDD_SD, DVDD_C supplies except for I2C[0] and I2C[1] pins.
(3) Whichever is smaller. P = the period of the applied signal. Maintaining transition times as fast as possible is recommended to improve noise immunity on input signals.
(4) For more detailed information on estimating junction temps within systems, see the IC Package Thermal Metrics Application Report (Literature Number: SPRA953).

5.3 Power-On Hours (POH)

The POH information in Table 5-1 is provided solely for convenience and does not extend or modify the warranty provided under TI’s standard terms and conditions for TI Semiconductor Products. To avoid significant device degradation, the device POH must be limited to those shown in Table 5-1.

Table 5-1 Power-On Hour Limits

Operating Condition Nominal CVDD Voltage (V) Junction Temperature (Tj) Lifetime POH(1)
100% OPP 1.1 -40 to 105 °C 100K
120% OPP 1.2 -40 to 105 °C 100K
166% OPP 1.35 -40 to 105 °C 49K
(1) POH represent device operation under the specified nominal conditions continuously for the duration of the calculated lifetime.

Logic functions and parameter values are not ensured out of the range specified in Section 5.2, Recommended Operating Conditions.

The above notations cannot be deemed a warranty or deemed to extend or modify the warranty under TI’s standard terms and conditions for semiconductor products.

5.4 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature (Unless Otherwise Noted)

PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
VOH Low/Full speed: USB_DM and USB_DP 2.8 VDD_USB_3P3 V
High speed: USB_DM and USB_DP 360 440 mV
High-level output voltage, LVCMOS(6) (3.3-V I/O) 3.3 V, DVDDx = MIN, IOH = MAX 2.4 V
High-level output voltage, LVCMOS(6) (1.8-V I/O) 1.8 V, DVDDx = MIN, IOH = MAX 1.26 V
VOL Low/Full speed: USB_DM and USB_DP 0.0 0.3 V
High speed: USB_DM and USB_DP -10 10 mV
Low-level output voltage, LVCMOS(6) (3.3-V I/O) 3.3 V, DVDDx = MAX, IOL = MAX 0.4 V
Low-level output voltage, LVCMOS(6) (1.8-V I/O) 1.8 V, DVDDx = MAX, IOL = MAX 0.4 V
Low-level output voltage, I2C (I2C[0], I2C[1]) 1.8/3.3 V, IOL = 4mA 0.4 V
LDOs (applies to all LDOCAP_x pins) 1.5 V
II(2) Input current, LVCMOS(6), 3.3 V mode 0 < VI < DVDDx, 3.3 V pull disabled -20 20 µA
0 < VI < DVDDx, 3.3 V pulldown enabled(3) 20 100 300 µA
0 < VI < DVDDx, 3.3 V pullup enabled(3) -20 -100 -300 µA
Input current, LVCMOS(6), 1.8 V mode 0 < VI < DVDDx, 1.8 V pull disabled -5 5 µA
0 < VI < DVDDx, 1.8 V pulldown enabled(3) 50 100 200 µA
0 < VI < DVDDx, 1.8 V pullup enabled(3) -50 -100 -200 µA
Input current, I2C (I2C[0], I2C[1]) 3.3 V mode -20 20 µA
1.8 V mode -5 5 µA
IOZ(4) I/O Off-state output current 3.3 V mode, pull enabled -300 300 µA
3.3 V mode, pull disabled -20 20 µA
1.8 V mode, pull enabled -200 200 µA
1.8 V mode, pull disabled -5 5 µA
ICDD Core (CVDD) supply current (scalable) see note (5) mA
ICVDD_ARM ARM Core Current (Scalable) see note (5) mA
IDDD 3.3-V I/O (DVDD, DVDD_GPMC, DVDD_GPMCB, DVDD_SD, DVDD_C, VDDA_USB_3P3) supply current see note (5) mA
1.8-V I/O (DVDD, DVDD_GPMC, DVDD_GPMCB, DVDD_SD, DVDD_C DVDD_M, DVDD_DDR[0], DVDD_DDR[1] [for DDR2], VDDA_x_1P8) supply current see note (5) mA
1.5-V I/O (DVDD_DDR[0], DVDD_DDR[1] [for DDR3 SDRAM]) supply current see note (5) mA
CI Input capacitance LVCMOS(6) 12 pF
Co Output capacitance LVCMOS(6) 12 pF
(1) For test conditions shown as MIN, MAX, or TYP, use the appropriate value specified in the recommended operating conditions table.
(2) II applies to input-only pins and bi-directional pins. For input-only pins, II indicates the input leakage current. For bi-directional pins, II indicates the input leakage current and off-state (Hi-Z) output leakage current.
(3) Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
(4) IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.
(5) The actual current draw varies across manufacturing processes and is highly application-dependent. For more details on core and I/O activity, as well as information relevant to board power supply design, see the TMS320DM814x/AM387x Power Estimation Spreadsheet Application Report (Literature Number: SPRABO3). To determine the worst-case power consumption values, use the TMS320DM814x/AM387x Power Estimation Spreadsheet Application Report.
(6) LVCMOS pins are all I/O pins powered by DVDD, DVDD_GPMC, DVDD_GPMCB, DVDD_SD, DVDD_C supplies except for I2C[0] and I2C[1] pins.

5.5 Thermal Resistance Characteristics (PBGA Package) [CYE-04] (Thinner Top Hat)

NO. °C/W(1) AIR FLOW (m/s)(2)
1 RΘJC Junction-to-case 0.39 N/A
2 RΘJB Junction-to-board 3.87 N/A
3 RΘJA Junction-to-free air 11.67 0.00
5 RΘJMA Junction-to-moving air 8.59 1.00
6 7.80 2.00
7 7.33 3.00
8 PsiJT Junction-to-package top 0.19 0.00
10 0.20 1.00
11 0.20 2.00
12 0.21 3.00
13 PsiJB Junction-to-board 3.44 0.00
15 3.37 1.00
16 3.26 2.00
17 3.17 3.00
(1) These measurements were conducted in a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] measurement, which was conducted in a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
  • JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
  • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-9, Test Boards for Area Array Surface Mount Packages

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
(2) m/s = meters per second