Refer to the PDF data sheet for device specific package drawings
The device package has been specially engineered with a new technology called Via Channel™. The Via Channel technology allows larger than normal PCB via sizes and reduced PCB signal layers to be used in a PCB design with this 0.8-mm pitch package, and will substantially reduce PCB costs. Via Channel also allows PCB routing in only two signal layers (four layers total) due to the increased layer efficiency of the Via Channel™ BGA technology.
The following packaging information and addendum reflect the most current data available for the designated device(s). This data is subject to change without notice and without revision of this document.