SPRSP56C January   2021  – February 2022 AM6411 , AM6412 , AM6421 , AM6441 , AM6442

ADVANCE INFORMATION  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Related Products
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
      1. 6.3.1  ADC
        1. 6.3.1.1 MAIN Domain
      2. 6.3.2  CPSW3G
        1. 6.3.2.1 MAIN Domain
      3. 6.3.3  CPTS
        1. 6.3.3.1 MAIN Domain
      4. 6.3.4  DDRSS
        1. 6.3.4.1 MAIN Domain
      5. 6.3.5  ECAP
        1. 6.3.5.1 MAIN Domain
      6. 6.3.6  Emulation and Debug
        1. 6.3.6.1 MAIN Domain
        2. 6.3.6.2 MCU Domain
      7. 6.3.7  EPWM
        1. 6.3.7.1 MAIN Domain
      8. 6.3.8  EQEP
        1. 6.3.8.1 MAIN Domain
      9. 6.3.9  FSI
        1. 6.3.9.1 MAIN Domain
      10. 6.3.10 GPIO
        1. 6.3.10.1 MAIN Domain
        2. 6.3.10.2 MCU Domain
      11. 6.3.11 GPMC
        1. 6.3.11.1 MAIN Domain
      12. 6.3.12 I2C
        1. 6.3.12.1 MAIN Domain
        2. 6.3.12.2 MCU Domain
      13. 6.3.13 MCAN
        1. 6.3.13.1 MAIN Domain
      14. 6.3.14 MCSPI
        1. 6.3.14.1 MAIN Domain
        2. 6.3.14.2 MCU Domain
      15. 6.3.15 MDIO
        1. 6.3.15.1 MAIN Domain
      16. 6.3.16 MMC
        1. 6.3.16.1 MAIN Domain
      17. 6.3.17 OSPI
        1. 6.3.17.1 MAIN Domain
      18. 6.3.18 Power Supply
      19. 6.3.19 PRU_ICSSG
        1. 6.3.19.1 MAIN Domain
      20. 6.3.20 Reserved
      21. 6.3.21 SERDES
        1. 6.3.21.1 MAIN Domain
      22. 6.3.22 System and Miscellaneous
        1. 6.3.22.1 Boot Mode Configuration
          1. 6.3.22.1.1 MAIN Domain
        2. 6.3.22.2 Clock
          1. 6.3.22.2.1 MCU Domain
        3. 6.3.22.3 System
          1. 6.3.22.3.1 MAIN Domain
          2. 6.3.22.3.2 MCU Domain
        4. 6.3.22.4 VMON
      23. 6.3.23 TIMER
        1. 6.3.23.1 MAIN Domain
        2. 6.3.23.2 MCU Domain
      24. 6.3.24 UART
        1. 6.3.24.1 MAIN Domain
        2. 6.3.24.2 MCU Domain
      25. 6.3.25 USB
        1. 6.3.25.1 MAIN Domain
    4. 6.4 Pin Connectivity Requirements
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Operating Performance Points
    6. 7.6  Power Consumption Summary
    7. 7.7  Electrical Characteristics
      1. 7.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 7.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 7.7.4  eMMCPHY Electrical Characteristics
      5. 7.7.5  SDIO Electrical Characteristics
      6. 7.7.6  LVCMOS Electrical Characteristics
      7. 7.7.7  ADC12B Electrical Characteristics
      8. 7.7.8  USB2PHY Electrical Characteristics
      9. 7.7.9  SERDES Electrical Characteristics
      10. 7.7.10 DDR Electrical Characteristics
    8. 7.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.8.2 Hardware Requirements
      3. 7.8.3 Programming Sequence
      4. 7.8.4 Impact to Your Hardware Warranty
    9. 7.9  Thermal Resistance Characteristics
      1. 7.9.1 Thermal Resistance Characteristics
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Sequencing
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Power-Up Sequencing
        3. 7.10.2.3 Power-Down Sequencing
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input Clocks / Oscillators
          1. 7.10.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
      5. 7.10.5 Peripherals
        1. 7.10.5.1  CPSW3G
          1. 7.10.5.1.1 CPSW3G MDIO Timing
          2. 7.10.5.1.2 CPSW3G RMII Timing
          3. 7.10.5.1.3 CPSW3G RGMII Timing
          4. 7.10.5.1.4 CPSW3G IOSETs
        2. 7.10.5.2  DDRSS
        3. 7.10.5.3  ECAP
        4. 7.10.5.4  EPWM
        5. 7.10.5.5  EQEP
        6. 7.10.5.6  FSI
        7. 7.10.5.7  GPIO
        8. 7.10.5.8  GPMC
          1. 7.10.5.8.1 GPMC and NOR Flash — Synchronous Mode
          2. 7.10.5.8.2 GPMC and NOR Flash — Asynchronous Mode
          3. 7.10.5.8.3 GPMC and NAND Flash — Asynchronous Mode
          4. 7.10.5.8.4 GPMC IOSETs
        9. 7.10.5.9  I2C
          1. 7.10.5.9.1 Timing Requirements for I2C Input Timings
        10. 7.10.5.10 MCAN
        11. 7.10.5.11 MCSPI
          1. 7.10.5.11.1 MCSPI — Master Mode
          2. 7.10.5.11.2 MCSPI — Slave Mode
        12. 7.10.5.12 MMCSD
          1. 7.10.5.12.1 MMC0 - eMMC Interface
            1. 7.10.5.12.1.1 Legacy SDR Mode
            2. 7.10.5.12.1.2 High Speed SDR Mode
            3. 7.10.5.12.1.3 High Speed DDR Mode
            4. 7.10.5.12.1.4 HS200 Mode
          2. 7.10.5.12.2 MMC1 - SD/SDIO Interface
            1. 7.10.5.12.2.1 Default Speed Mode
            2. 7.10.5.12.2.2 High Speed Mode
            3. 7.10.5.12.2.3 UHS–I SDR12 Mode
            4. 7.10.5.12.2.4 UHS–I SDR25 Mode
            5. 7.10.5.12.2.5 UHS–I SDR50 Mode
            6. 7.10.5.12.2.6 UHS–I DDR50 Mode
            7. 7.10.5.12.2.7 UHS–I SDR104 Mode
        13. 7.10.5.13 CPTS
        14. 7.10.5.14 OSPI
          1. 7.10.5.14.1 OSPI With Data Training
            1. 7.10.5.14.1.1 OSPI Switching Characteristics – Data Training
          2. 7.10.5.14.2 OSPI Without Data Training
            1. 7.10.5.14.2.1 OSPI SDR Timing
            2. 7.10.5.14.2.2 OSPI DDR Timing
        15. 7.10.5.15 PCIe
        16. 7.10.5.16 PRU_ICSSG
          1. 7.10.5.16.1 PRU_ICSSG Programmable Real-Time Unit (PRU)
            1. 7.10.5.16.1.1 PRU_ICSSG PRU Direct Output Mode Timing
            2. 7.10.5.16.1.2 PRU_ICSSG PRU Parallel Capture Mode Timing
            3. 7.10.5.16.1.3 PRU_ICSSG PRU Shift Mode Timing
            4. 7.10.5.16.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface
              1. 7.10.5.16.1.4.1 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Timing
          2. 7.10.5.16.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 7.10.5.16.2.1 PRU_ICSSG PWM Timing
          3. 7.10.5.16.3 PRU_ICSSG Industrial Ethernet Peripheral (IEP)
            1. 7.10.5.16.3.1 PRU_ICSSG IEP Timing
          4. 7.10.5.16.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (UART)
            1. 7.10.5.16.4.1 PRU_ICSSG UART Timing
          5. 7.10.5.16.5 PRU_ICSSG Enhanced Capture Peripheral (ECAP)
            1. 7.10.5.16.5.1 PRU_ICSSG ECAP Timing
          6. 7.10.5.16.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 7.10.5.16.6.1 PRU_ICSSG MDIO Timing
            2. 7.10.5.16.6.2 PRU_ICSSG MII Timing
            3. 7.10.5.16.6.3 PRU_ICSSG RGMII Timing
        17. 7.10.5.17 Timers
        18. 7.10.5.18 UART
        19. 7.10.5.19 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A53 Subsystem
      2. 8.2.2 Arm Cortex-R5F Subsystem (R5FSS)
      3. 8.2.3 Arm Cortex-M4F (M4FSS)
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG)
    4. 8.4 Other Subsystems
      1. 8.4.1 PDMA Controller
      2. 8.4.2 Peripherals
        1. 8.4.2.1  ADC
        2. 8.4.2.2  DCC
        3. 8.4.2.3  Dual Date Rate (DDR) External Memory Interface (DDRSS)
        4. 8.4.2.4  ECAP
        5. 8.4.2.5  EPWM
        6. 8.4.2.6  ELM
        7. 8.4.2.7  ESM
        8. 8.4.2.8  GPIO
        9. 8.4.2.9  EQEP
        10. 8.4.2.10 GPMC
        11. 8.4.2.11 I2C
        12. 8.4.2.12 MCAN
        13. 8.4.2.13 MCRC Controller
        14. 8.4.2.14 MCSPI
        15. 8.4.2.15 MMCSD
        16. 8.4.2.16 OSPI
        17. 8.4.2.17 Peripheral Component Interconnect Express (PCIe)
        18. 8.4.2.18 Serializer/Deserializer (SerDes)
        19. 8.4.2.19 RTI
        20. 8.4.2.20 DMTIMER
        21. 8.4.2.21 UART
        22. 8.4.2.22 Universal Serial Bus Subsystem(USBSS)
  9. 9 Applications, Implementation, and Layout
    1. 9.1 Power Supply Mapping
    2. 9.2 Device Connection and Layout Fundamentals
      1. 9.2.1 Power Supply Decoupling and Bulk Capacitors
        1. 9.2.1.1 Power Distribution Network Implementation Guidance
      2. 9.2.2 External Oscillator
      3. 9.2.3 JTAG and EMU
      4. 9.2.4 Reset
      5. 9.2.5 Unused Pins
      6. 9.2.6 Hardware Design Guide
    3. 9.3 Peripheral- and Interface-Specific Design Information
      1. 9.3.1 DDR Board Design and Layout Guidelines
      2. 9.3.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 9.3.2.1 No Loopback and Internal Pad Loopback
        2. 9.3.2.2 External Board Loopback
        3. 9.3.2.3 DQS (only available in Octal Flash devices)
      3. 9.3.3 USB VBUS Design Guidelines
      4. 9.3.4 System Power Supply Monitor Design Guidelines
      5. 9.3.5 High Speed Differential Signal Routing Guidance
      6. 9.3.6 External Capacitors
      7. 9.3.7 Thermal Solution Guidance
  10. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALV|441
Thermal pad, mechanical data (Package|Pins)
Orderable Information