SBASAW1A September   2023  – December 2023 AMC21C12

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information 
    5. 5.5 Package Characteristics
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics 
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Reference Input
      3. 6.3.3 Isolation Channel Signal Transmission
      4. 6.3.4 Open-Drain Digital Output
        1. 6.3.4.1 Transparent Output Mode
        2. 6.3.4.2 Latch Output Mode
      5. 6.3.5 Power-Up and Power-Down Behavior
      6. 6.3.6 VDD1 Brownout and Power-Loss Behavior
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Overcurrent Detection
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Overvoltage Detection
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DEN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)
MIN NOM MAX UNIT
POWER SUPPLY
VVDD1 High-side power-supply voltage VDD1 to GND1 3.0 5 27 V
VVDD2 Low-side power supply voltage VDD2 to GND2 2.7 3.3 5.5 V
ANALOG INPUT
VIN Input voltage IN to GND1, VDD1 ≤ 4.3 V –0.4               VDD1 – 0.3 V
IN to GND1, VDD1 > 4.3 V –0.4 4
VREF Reference voltage, window comparator mode REF to GND1 20(2) 300 mV
Reference voltage, positive-comparator mode Low hysteresis mode 20(2) 450
High hysteresis mode
(Cmp0 only)		 600 2700(1)
Reference voltage headroom VDD1 – VREF 1.4 V
Filter capacitance on REF pin 20 100 nF
DIGITAL I/O
Digital input voltage LATCH pin GND2 VDD2 V
Digital output voltage OUT to GND2 GND2 VDD2 V
Sink current OUT 0 4 mA
ISOLATION BARRIER
VIOWM Functional isolation working voltage(3) AC voltage (sine wave) 200 VRMS
DC voltage 280 VDC
TEMPERATURE RANGE
TA Specified ambient temperature –40 25 125 °C
(1) Reference voltages (VREF) >1.6 V require VVDD1 > VVDD1,MIN to maintain minimum headroom (VVDD1 – VREF) of 1.4 V.
(2) The device has been tested with VREF as low as 5 mV. The device remains functional but relative switching threshold accuracy can decrease because of offset errors.
(3) Common-mode from left-side (pin1-4) to right-side (pin5-8) of the package.