SWRS325A December   2024  – December 2025 AWRL6844

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configurations and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
      1.      11
      2.      12
      3.      13
      4.      14
      5.      15
      6.      16
      7.      17
      8.      18
      9.      19
      10.      20
      11.      21
      12.      22
      13.      23
      14.      24
      15.      25
      16.      26
      17.      27
      18.      28
    3.     29
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
      1. 7.6.1 3.3V I/O Topology
      2. 7.6.2 1.8V I/O Topology
      3. 7.6.3 System Topologies
        1. 7.6.3.1 I/O Topologies
      4. 7.6.4 RF Supply Decoupling Capacitor and Layout Conditions
        1. 7.6.4.1 1.2V RF Supply Rail
          1. 7.6.4.1.1 1.2V RF Rail
        2. 7.6.4.2 1.0V RF LDO
          1. 7.6.4.2.1 1.0V RF LDO
      5. 7.6.5 Noise and Ripple Specifications
    7. 7.7  Power Save Modes
      1. 7.7.1 Typical Power Consumption Numbers
    8. 7.8  Peak Current Requirement per Voltage Rail
    9. 7.9  RF Specification
    10. 7.10 Supported DFE Features
    11. 7.11 CPU Specifications
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 Timing and Switching Characteristics
      1. 7.13.1  Power Supply Sequencing and Reset Timing
      2. 7.13.2  Synchronized Frame Triggering
      3. 7.13.3  Input Clocks and Oscillators
        1. 7.13.3.1 Clock Specifications
      4. 7.13.4  MultiChannel buffered / Standard Serial Peripheral Interface (McSPI)
        1. 7.13.4.1 McSPI Features
        2. 7.13.4.2 SPI Timing Conditions
        3. 7.13.4.3 SPI—Controller Mode
          1. 7.13.4.3.1 Timing and Switching Requirements for SPI - Controller Mode
          2. 7.13.4.3.2 Timing and Switching Characteristics for SPI Output Timings—Controller Mode
        4. 7.13.4.4 SPI—Peripheral Mode
          1. 7.13.4.4.1 Timing and Switching Requirements for SPI - Peripheral Mode
          2. 7.13.4.4.2 Timing and Switching Characteristics for SPI Output Timings—Secondary Mode
      5. 7.13.5  LVDS Instrumentation and Measurement Peripheral
        1. 7.13.5.1 LVDS Interface Configuration
        2. 7.13.5.2 LVDS Interface Timings
      6. 7.13.6  LIN
      7. 7.13.7  General-Purpose Input/Output
        1. 7.13.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 7.13.8  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.13.8.1 Dynamic Characteristics for the CANx TX and RX Pins
      9. 7.13.9  Serial Communication Interface (SCI)
        1. 7.13.9.1 SCI Timing Requirements
      10. 7.13.10 Inter-Integrated Circuit Interface (I2C)
        1. 7.13.10.1 I2C Timing Requirements
      11. 7.13.11 Quad Serial Peripheral Interface (QSPI)
        1. 7.13.11.1 QSPI Timing Conditions
        2. 7.13.11.2 Timing Requirements for QSPI Input (Read) Timings
        3. 7.13.11.3 QSPI Switching Characteristics
      12. 7.13.12 JTAG Interface
        1. 7.13.12.1 JTAG Timing Conditions
        2. 7.13.12.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.13.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1  RF and Analog Subsystem
      2. 8.3.2  Clock Subsystem
      3. 8.3.3  Transmit Subsystem
      4. 8.3.4  Receive Subsystem
      5. 8.3.5  Processor Subsystem
      6. 8.3.6  Automotive Interface
      7. 8.3.7  Host Interface
      8. 8.3.8  Application Subsystem Cortex-R5F
      9. 8.3.9  DSP Subsystem
      10. 8.3.10 Hardware Accelerator (HWA1.2) Features
        1. 8.3.10.1 Hardware Accelerator Feature Differences Between HWA1.1 in xWRx843, HWA1.2 in xWRLx432 and HWA1.2 in xWRL684x
    4. 8.4 Other Subsystems
      1. 8.4.1 Security – Hardware Security Module
      2. 8.4.2 GPADC Channels (Service) for User Application
      3. 8.4.3 GPADC Parameters
    5. 8.5 Memory Partitioning Options
    6. 8.6 Boot Modes
  10. 9 Monitoring and Diagnostics
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • ANC|207
Thermal pad, mechanical data (Package|Pins)
7.6.4.2.1 1.0V RF LDO

Ball name: VDDA_10RF

Table 7-4 1.0V RF LDO Output
Min Typ Max Unit
Recommended value(s) of C C1 22.0(1) uF
C2 10.0(2) uF
Allowed parasitic inductance Ball to 1st Capacitor lead (LT1) + Along 1st Capacitor (ESL1 + LT2) 1.1 2.3 nH
Ball to 1st Capacitor lead (LT1) + Along the 2nd Capacitor (ESL2 + LT2) 1.1 2.3
From D5, D6, D7 BGA balls to K5 BGA ball 0.1
Allowed parasitic resistance Ball to 1st Capacitor lead (RT1) + Along 1st Capacitor (ESR1 + RT2) 4.5 8.5 mOhm
Ball to 1st Capacitor lead (RT1) +Along the 2nd Capacitor (ESR2 + RT2) 4.5 8.5
From D5, D6, D7 BGA balls to K5 BGA ball 50
(1) Capacitor is required to maintain capacitance between 10.8uF and 22.9uF at 1.0V DC bias across operating temperature range
(2) Capacitor is required to maintain capacitance between 4.5uF and 9.9uF at 1.0V DC bias across operating temperature range

Place two decoupling capacitors as close as possible to the VDDA_10RF BGA balls and position them adjacent to each other to minimize parasitics between two capcitor leads (RTC2C & LTC2C). The recommended decoupling capacitor placement relative to the BGA balls and to each other is illustrated in the Figure 7-6. Refer to Altium AWRL6844 EVM Design Files for more details.


AWRL6844 AWRL6843 EVM Layout Example

Figure 7-6 EVM Layout Example

Connect D5, D6 and D7 VDDA10_RFR BGA balls to K5 VDDA10_RF BGA ball using a wider copper plane. An example of the recommended layout illustrated in the Figure 7-7. Refer to Altium AWRL6844 EVM Design Files for more details.


AWRL6844 AWRL6843 EVM Layout Example

Figure 7-7 EVM Layout Example