SLUSBT8 July   2014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Application Information
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Down
      2. 8.3.2 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation
        1. 8.4.1.1 Input Overvoltage Protection
        2. 8.4.1.2 Input Overcurrent Protection
        3. 8.4.1.3 Battery Overvoltage Protection
        4. 8.4.1.4 Thermal Protection
        5. 8.4.1.5 Enable Function
        6. 8.4.1.6 Fault Indication
  9. 9 Application and Implementation
    1. 9.1 Typical Application Circuit
      1. 9.1.1 Design Requirements
        1. 9.1.1.1 Selection of RILIM
        2. 9.1.1.2 Selection of RBAT
        3. 9.1.1.3 Selection of R(CE), R(FAULT), and R(PU)
        4. 9.1.1.4 Selection of Input and Output Bypass Capacitors
      2. 9.1.2 Detailed Design Procedures
        1. 9.1.2.1 Powering Accessories
      3. 9.1.3 Application Curves
  10. 10Power Supply Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

DSG PACKAGE
(TOP VIEW)
po_slusbt8.gif

Pin Functions

PIN I/O DESCRIPTION
NAME DSG
IN 1 I Input power, connect to external DC supply. Connect external 1μF ceramic capacitor (minimum) to VSS.
OUT 8 O Output pin to the charging system. Connect external 1 μF ceramic capacitor (minimum) to VSS.
VBAT 6 I Battery voltage sense input. Connect to pack positive pin through a resistor.
ILIM 7 I/O Input overcurrent threshold programming. Connect a resistor to VSS to set the overcurrent threshold.
CE 5 I Chip enable input. Active low. When CE = High, the input FET is off. Internally pulled down.
FAULT 4 O Device status, open-drain output. FAULT = Low indicates that the input FET Q1 has been turned on due to input overvoltage, input overcurrent, battery overvoltage, or thermal shutdown.
VSS 2 – Ground pin
NC 3 This pin may have internal circuits used for test purposes. Do not make any external connections at these pins for normal operation.
Thermal PAD – There is an internal electrical connection between the exposed thermal pad and the VSS pin of the device. The thermal pad must be connected to the same potential as the VSS pin on the printed circuit board. Do not use the thermal pad as the primary ground input for the device. The VSS pin must be connected to ground at all times.