SLUSBT8 July   2014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Application Information
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Down
      2. 8.3.2 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation
        1. 8.4.1.1 Input Overvoltage Protection
        2. 8.4.1.2 Input Overcurrent Protection
        3. 8.4.1.3 Battery Overvoltage Protection
        4. 8.4.1.4 Thermal Protection
        5. 8.4.1.5 Enable Function
        6. 8.4.1.6 Fault Indication
  9. 9 Application and Implementation
    1. 9.1 Typical Application Circuit
      1. 9.1.1 Design Requirements
        1. 9.1.1.1 Selection of RILIM
        2. 9.1.1.2 Selection of RBAT
        3. 9.1.1.3 Selection of R(CE), R(FAULT), and R(PU)
        4. 9.1.1.4 Selection of Input and Output Bypass Capacitors
      2. 9.1.2 Detailed Design Procedures
        1. 9.1.2.1 Powering Accessories
      3. 9.1.3 Application Curves
  10. 10Power Supply Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN MAX UNIT
Input voltage IN (with respect to VSS) –0.3 30 V
OUT (with respect to VSS) –0.3 12
ILIM, FAULT, CE, VBAT (with respect to VSS) –0.3 7
Input current IN 0.5 A
Output current OUT 0.5 A
Output sink current FAULT 15 mA
Junction temperature, TJ –40 150 °C

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
VESD Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2000 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) –500 500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage range 3 26 V
IIN Input current, IN pin 50 300 mA
IOUT Output current, OUT pin 50 300 mA
RILIM OCP Programming resistor 83.3 500 kΩ
TJ Junction temperature –40 125 °C

7.4 Thermal Information

THERMAL METRIC(1) DSG UNITS
8 PINS
RθJA Junction-to-ambient thermal resistance 86.3 °C/W
RθJCtop Junction-to-case (top) thermal resistance 116.9
RθJB Junction-to-board thermal resistance 56.1
ψJT Junction-to-top characterization parameter 8.1
ψJB Junction-to-board characterization parameter 56.4
RθJCbot Junction-to-case (bottom) thermal resistance 25.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over junction temperature range –40°C to 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IN
V(UVLO) Undervoltage lock-out, input power detected threshold CE = Low, VIN increasing from 0 V to 3 V 2.6 2.7 2.8 V
V(UVLO_HYS) Hysteresis on UVLO CE = Low, VIN decreasing from 3 V to 0 V 200 260 300 mV
IDD Operating current CE = Low, No load on OUT pin,
VIN = 5 V, R(ILIM) = 200 kΩ		 400 500 μA
I(STDBY) Standby current CE = High, VIN = 5 V 65 95 μA
INPUT TO OUTPUT CHARACTERISTICS
V(DO) Drop-out voltage IN to OUT CE = Low, VIN = 5 V, IOUT = 0.125 A 21 35 mV
INPUT OVERVOLTAGE PROTECTION
V(OVP) Input overvoltage protection threshold CE = Low, VIN increasing from 5V to 7.5 V 5.71 5.85 6.00 V
VHYS-OVP Hysteresis on OVP CE = Low, VIN decreasing from 7.5 V to 5 V 20 60 110 mV
INPUT OVERCURRENT PROTECTION
I(OCP) Input overcurrent protection threshold range 50 300 mA
Input overcurrent protection threshold CE = Low, RILIM = 200 kΩ,
3 V ≤ VIN < VOVP		 TJ = 0°C to 85°C 110 125 135 mA
TJ = 0°C to 125°C 110 125 140
BATTERY OVERVOLTAGE PROTECTION
V(BOVP) Battery overvoltage protection threshold CE = Low, VIN > 4.4 V 4.30 4.35 4.4 V
V(HYS-BOVP) Hysteresis on V(BOVP) CE = Low, VIN > 4.4 V 200 275 320 mV
I(VBAT) Input bias current on VBAT pin VBAT = 4.4 V, TJ = 25°C 10 nA
THERMAL PROTECTION
TJ(OFF) Thermal shutdown temperature 140 150 °C
TJ(OFF-HYS) Thermal shutdown hysteresis 20 °C
LOGIC LEVELS ON CE
VIL Low-level input voltage 0 0.4 V
VIH High-level input voltage 1.4 V
IIL Low-level input current VCE = 0 V 1 μA
IIH High-level input current VCE = 1.8 V 15 μA
LOGIC LEVELS ON FAULT
VOL Output low voltage I(SINK) = 5 mA 0.2 V
I(HI-Z) Leakage current, FAULT pin HI-Z V(FAULT) = 5 V 10 μA
(1) Not tested in production. Specified by design.

7.6 Timing Requirements

MIN TYP MAX UNIT
tDGL(PGOOD) Deglitch time, input power detected status CE = Low. Time measured from VIN 0 V → 5 V 1 μs rise-time, to output turning ON 8 ms
tPD(OVP) Input OV propagation delay(1) CE = Low 1 μs
tON(OVP) Recovery time from input overvoltage condition CE = Low, Time measured from
VIN 7.5 V → 5 V, 1μs fall-time		 8 ms
tBLANK(OCP) Blanking time, input overcurrent detected 176 μs
tREC(OCP) Recovery time from input overcurrent condition 64 ms
tDGL(BOVP) Deglitch time, battery overvoltage detected CE = Low, VIN > 4.4 V. Time measured from V(VBAT) rising from 4.1 V to 4.4 V to FAULT going low. 176 μs

7.7 Typical Characteristics

Test conditions (unless otherwise noted) for typical operating performance: VIN = 5 V, CIN = 1 μF, COUT = 1 μF, R(ILIM) = 200 kΩ, R(BAT) = 100 kΩ, TA = 25°C, V(PU) = 3.3 V (see Figure 11 for the Typical Application Circuit)

vuvlo_ta_lus763.gif
Figure 1. Undervoltage Lockout vs Free-Air Temperature
vovp2_ta_lus763.gif
Figure 3. Overvoltage Threshold Protection vs Free-Air Temperature
D003_SLUSBT8.gifFigure 5. Input Overcurrent Protection vs Free-Air Temperature
ivbat_ta_lusbt8.gif
Figure 7. Leakage Current (VBAT Pin) vs Free-Air Temperature
D004_SLUSBT8.gif
Figure 2. Dropout Voltage (In to Out) vs Free-Air Temperature
D001_SLUSBT8.gif
Figure 4. Input Overcurrent Protection vs ILIM Resistance
bvop_ta_lusbt8.gifFigure 6. Battery Overvoltage Protection vs Free-Air Temperature
D002_SLUSBT8.gif
Figure 8. Supply Current vs Input Voltage