SLUSF65 October   2023 BQ25185

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Battery Charging Process
        1. 8.1.1.1 Trickle Charge
        2. 8.1.1.2 Pre-Charge
        3. 8.1.1.3 Fast Charge
        4. 8.1.1.4 ISET Pin Detection
        5. 8.1.1.5 Termination
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Based Dynamic Power Management (VINDPM)
      2. 8.3.2  Dynamic Power Path Management Mode (DPPM)
      3. 8.3.3  Battery Supplement Mode
      4. 8.3.4  Sleep Mode
      5. 8.3.5  SYS Regulation
      6. 8.3.6  ILIM/VSET Control
      7. 8.3.7  Protection Mechanisms
        1. 8.3.7.1 Input Overvoltage Protection
        2. 8.3.7.2 Battery Undervoltage Lockout
        3. 8.3.7.3 Battery Overcurrent Protection
        4. 8.3.7.4 System Overvoltage Protection
        5. 8.3.7.5 System Short Protection
        6. 8.3.7.6 Thermal Protection and Thermal Regulation
        7. 8.3.7.7 Safety Timer
      8. 8.3.8  Pushbutton Wake and Reset Input
        1. 8.3.8.1 Pushbutton Long Button Press Function - Factory mode
      9. 8.3.9  External NTC Monitoring (TS)
        1. 8.3.9.1 TS Biasing and Function
      10. 8.3.10 Status Pins
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Current and Battery Regulation Voltage - ILIM/VSET
        2. 9.2.2.2 Fast Charge Current- ISET
        3. 9.2.2.3 Recommended Passive Components
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2.3 Recommended Passive Components

Low ESR ceramic capacitors such as X7R or X5R are preferred for input decoupling capacitors and should be placed as close as possible to the supply and ground pins for the IC. Due to the voltage derating of the capacitors, it is recommended that 25-V rated capacitors are used for the IN and SYS pins which can normally operate at 5 V. After derating the minimum capacitance must be higher than 1 µF.

MIN

NOM

MAX

UNIT

CSYS

Capacitance on SYS pin

1

10

100

 μF

CBAT

Capacitance on BAT pin

1

1

-

 μF

CIN

Capacitance on IN pin (tVIN_PRESENT > 25 ms)

1

 μF