SLUSEB5B December   2022  – September 2025 BQ27427

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Supply Current
    6. 5.6  Digital Input and Output DC Characteristics
    7. 5.7  LDO Regulator, Wake-up, and Auto-Shutdown DC Characteristics
    8. 5.8  LDO Regulator, Wake-up, and Auto-Shutdown AC Characteristics
    9. 5.9  ADC (Temperature and Cell Measurement) Characteristics
    10. 5.10 Integrating ADC (Coulomb Counter) Characteristics
    11. 5.11 Integrated Sense Resistor Characteristics, –40°C to 85°C
    12. 5.12 I2C-Compatible Interface Communication Timing Characteristics
    13. 5.13 SHUTDOWN and WAKE-UP Timing
    14. 5.14 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Communications
        1. 6.3.1.1 I2C Interface
        2. 6.3.1.2 I2C Time Out
        3. 6.3.1.3 I2C Command Waiting Time
        4. 6.3.1.4 I2C Clock Stretching
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 BAT Voltage Sense Input
        2. 7.2.2.2 Integrated LDO Capacitor
      3. 7.2.3 External Thermistor Support
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendation
      1. 7.3.1 Power Supply Decoupling
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Related Documentation
    2. 8.2 Trademarks
    3. 8.3 Electrostatic Discharge Caution
    4. 8.4 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.