SLUSET3
December 2022
BQ28Z620
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Description (continued)
6
BQ28Z620 Changes from BQ28Z610-R1
7
Pin Configuration and Functions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Thermal Information
8.5
Supply Current
8.6
Power Supply Control
8.7
Power-On Reset (POR)
8.8
Internal 1.8-V LDO
8.9
Current Wake Comparator
8.10
Coulomb Counter
8.11
ADC Digital Filter
8.12
ADC Multiplexer
8.13
Cell Balancing Support
8.14
Internal Temperature Sensor
8.15
NTC Thermistor Measurement Support
8.16
High-Frequency Oscillator
8.17
Low-Frequency Oscillator
8.18
Voltage Reference 1
8.19
Voltage Reference 2
8.20
Instruction Flash
8.21
Data Flash
8.22
Current Protection Thresholds
8.23
Current Protection Timing
8.24
N-CH FET Drive (CHG, DSG)
8.25
I2C Interface I/O
8.26
I2C Interface Timing
8.27
Typical Characteristics
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Battery Parameter Measurements
9.3.1.1
BQ28Z620 Processor
9.3.2
Coulomb Counter (CC)
9.3.3
CC Digital Filter
9.3.4
ADC Multiplexer
9.3.5
Analog-to-Digital Converter (ADC)
9.3.6
ADC Digital Filter
9.3.7
Internal Temperature Sensor
9.3.8
External Temperature Sensor Support
9.3.9
Power Supply Control
9.3.10
Power-On Reset
9.3.11
Bus Communication Interface
9.3.12
I2C Timeout
9.3.13
Cell Balancing Support
9.3.14
N-Channel Protection FET Drive
9.3.15
Low Frequency Oscillator
9.3.16
High Frequency Oscillator
9.3.17
1.8-V Low Dropout Regulator
9.3.18
Internal Voltage References
9.3.19
Overcurrent in Discharge Protection
9.3.20
Short-Circuit Current in Charge Protection
9.3.21
Short-Circuit Current in Discharge 1 and 2 Protection
9.3.22
Primary Protection Features
9.3.23
Gas Gauging
9.3.24
Charge Control Features
9.3.25
Authentication
9.4
Device Functional Modes
9.4.1
Lifetime Logging Features
9.4.2
Configuration
9.4.2.1
Coulomb Counting
9.4.2.2
Cell Voltage Measurements
9.4.2.3
Current Measurements
9.4.2.4
Auto Calibration
9.4.2.5
Temperature Measurements
10
Applications and Implementation
10.1
Application Information
10.2
Typical Applications
10.2.1
Design Requirements (Default)
10.2.2
Detailed Design Procedure
10.2.2.1
Setting Design Parameters
10.2.2.2
Calibration Process
10.2.2.3
Gauging Data Updates
10.2.3
Application Curve
11
Power Supply Recommendations
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
Device and Documentation Support
13.1
Documentation Support
13.2
Receiving Notification of Documentation Updates
13.3
Support Resources
13.4
Trademarks
13.5
Electrostatic Discharge Caution
13.6
Glossary
14
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DRZ|12
MPDS289B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sluset3_oa
sluset3_pm
13.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.