SLUSAS0F December   2011  – July 2025 BQ2946

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sense Positive Input for V1
      2. 7.3.2 Output Drive, OUT
      3. 7.3.3 Supply Input, VDD
      4. 7.3.4 Thermal Pad, PWRPAD
    4. 7.4 Device Functional Modes
      1. 7.4.1 NORMAL Mode
      2. 7.4.2 OVERVOLTAGE Mode
      3. 7.4.3 Customer Test Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Application Configuration
      2. 8.1.2 29
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Example
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)BQ2946xxUNIT
DRV (SON)
6 PINS
RθJAJunction-to-ambient thermal resistance186.4°C/W
RθJC(top)Junction-to-case(top) thermal resistance90.4°C/W
RθJBJunction-to-board thermal resistance110.7°C/W
ψJTJunction-to-top characterization parameter96.7°C/W
ψJBJunction-to-board characterization parameter90°C/W
RθJC(bot)Junction-to-case(bottom) thermal resistancen/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.